Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mirror surface chromium copper computer numerical control (CNC) machining process applied to hemispheroid or semi-ellipsoid machining

A semi-ellipsoid and processing technology, which is applied in the direction of electric processing equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of uneven surface precision and easy formation of tool marks on copper males

Inactive Publication Date: 2019-05-24
天键电声股份有限公司
View PDF10 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the manufacturing process of Tonggong, milling is generally carried out through traditional parallel milling, contour milling or fixed contour milling. The tool path has multiple advance and retreat routes, which is easy to form tool marks and requires further polishing. Polishing The accuracy of the copper surface is uneven

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mirror surface chromium copper computer numerical control (CNC) machining process applied to hemispheroid or semi-ellipsoid machining
  • Mirror surface chromium copper computer numerical control (CNC) machining process applied to hemispheroid or semi-ellipsoid machining
  • Mirror surface chromium copper computer numerical control (CNC) machining process applied to hemispheroid or semi-ellipsoid machining

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to make the technical problems, technical solutions and beneficial effects solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0022] Such as Figure 1 to Figure 3 As shown, the embodiment of the present application proposes a mirror-surface chrome-copper CNC machining process applied to hemispherical or semi-ellipsoidal processing, especially suitable for processing copper males, including the following steps:

[0023] S1, clamping the blank on the spindle of the CNC machine tool, specifically, the blank is a cuboid;

[0024] S2, start the main shaft, make the main shaft drive the blank to rotate, and select the tool 10 to perform cutting processing on the blank, so th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of copper electrode machining, in particular to a mirror surface chromium copper computer numerical control (CNC) machining process applied to hemispheroid or semi-ellipsoid machining. The mirror surface chromium copper CNC machining process comprises the steps: S1, a blank is clamped on a spindle of a CNC machine tool; and S2, the spindle is started to drive theblank to rotate, a cutter is selected to cut the blank, thus the blank forms a base and a machining part, the machining part is in a hemispheroid or semi-ellipsoid mirror surface profile, the machining part extends out of a main surface of the base, the axis of the machining part coincides with the axis of the spindle, and the cutter conducts one-time feed along the set route. The cutter conductsmachining along the set route, by cooperating with rotation movement of the spindle, the blank can be very smoothly machined into the mirror surface hemispheroid or semi-ellipsoid profile through one-time feed, step-shaped cutter marks caused by multiple engage and retract actions during traditional processing are avoided, further polishing is not needed, and accuracy is uniform.

Description

【Technical field】 [0001] The present application relates to the field of copper machining, in particular to a mirror-surface chrome-copper CNC machining process applied to the machining of hemispheres or semiellipsoids. 【Background technique】 [0002] Copper male is the electrode used for EDM, and the EDM with copper male as the electrode is mainly used for cavity processing of molds. In the manufacturing process of Tonggong, milling is generally carried out through traditional parallel milling, contour milling or fixed contour milling. The tool path has multiple advance and retreat routes, which is easy to form tool marks and requires further polishing. Polishing The accuracy of the copper surface is uneven. 【Content of invention】 [0003] In order to solve the above-mentioned technical problems, the purpose of this application is to provide a mirror-surface chrome-copper CNC machining process applied to the processing of hemispheres or semi-ellipsoids, through which the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23C3/02B23H1/04
Inventor 梁永秒
Owner 天键电声股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com