Resistor slurry

A technology of resistance paste and conductive powder, applied in resistors, non-adjustable metal resistors, circuits, etc., can solve the problems of large resistance value dispersion and large current noise, and achieve reduced resistance value dispersion and current noise. reduced effect

Inactive Publication Date: 2019-05-28
山东天拓电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current resistance paste used in the circuit makes the current noise in the circuit large and the resistance value dispersion is large

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Embodiment 1: A kind of resistance paste, comprises glass powder, conductive powder, organic medium, and the weight content of described glass powder is 10-60g, and the weight content of conductive powder is 15-70g, and the weight content of organic medium is 20 ~60g.

Embodiment 2

[0009] Embodiment 2: A resistance paste, including glass powder, conductive powder, and organic medium. The glass powder has a weight content of 10 g, the conductive powder has a weight content of 15 g, and the organic medium has a weight content of 20 g.

Embodiment 3

[0010] Implementation 3: A resistance paste comprising glass powder, conductive powder, and organic medium. The glass powder contains 60 g by weight, the conductive powder contains 70 g by weight, and the organic medium contains 60 g by weight.

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PUM

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Abstract

The invention relates to a slurry formula for forming a resistor, in particular to a resistor slurry. The resistor slurry comprises the following components in parts by weight: 10-60 parts of glass powder, 15-70 parts of conductive powder and 20-60 parts of organic medium. The resistor slurry comprises, in parts by weight, 25 parts of the glass powder, 35 parts of the conductive powder and 40 parts of the organic medium. After the resistor slurry is sintered, the current noise of a circuit is obviously reduced, and the resistance value dispersity is obviously reduced.

Description

technical field [0001] The present invention relates to a paste formulation for forming resistors. Background technique [0002] Now, the thick film method is the main method of forming a resistance film in the process of electronic component manufacturing. This method is to print the resistance paste on the ceramic substrate and form a thick film resistor after sintering. This method is due to its low cost and production efficiency. High, widely used in the manufacture of chip resistors and integrated circuit resistors and so on. However, the currently used resistor paste makes the current noise in the circuit large, and the resistance value dispersion is large. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a plasma resist material with less current noise and less resistance dispersion. [0004] The technical solution adopted in the present invention is: a kind of resistance paste, in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/14H01B1/20H01C7/00
Inventor 王方民周朝兵王明磊马振中
Owner 山东天拓电子科技有限公司
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