The invention discloses a notebook computer radiator based on a semiconductor heat pump

Abstract

A notebook computer radiator based on a semiconductor heat pump relates to a radiator which is used for a notebook computer and is different from a traditional air cooling heat exchange radiator. Theradiator is composed of a radiator shell, an air inlet duct optimization cushion block, a heat pump hot end heat exchange fan, heat pump hot end heat dissipation fins, a semiconductor heat pump, heatpump cold end refrigeration fins and a heat pump cold end refrigeration convection fan. The heat pump cold end refrigeration convection fan (7) is fixedly connected with the heat pump cold end refrigeration fins (6); The semiconductor heat pump (5), the heat pump cold end refrigeration fins (6) and the heat pump hot end heat dissipation fins (4) are attached and fixed through heat conduction materials. And the heat pump hot end heat exchange fan (3) and the heat pump hot end radiating fins (4) are connected and fixedly arranged in the radiator shell (1) provided with the air inlet duct optimization cushion block (2). The semiconductor heat pump is used for transferring the temperature of the cold end, and the heat pump cold end refrigeration convection fan is used for carrying out forced convection heat exchange so as to achieve the effect of cooling the D surface of the notebook computer through enhanced heat exchange.

Description

technical field [0001] The invention relates to a notebook computer radiator based on a semiconductor heat pump, and is especially proposed for the poor thermal performance of the active fan of the notebook computer itself. Background technique [0002] Laptops are more and more popular because of their small size and portability, but precisely because of their small size, heat dissipation has become a shortcoming of this type of product. Working for a long time causes high heat-generating components such as CPU and GPU to fail to dissipate heat in time, resulting in excessive temperature and performance degradation. [0003] Starting from the principle and technical defects of most external heat sinks in the market, a new heat dissipation scheme is proposed, and a new type of notebook computer heat sink is innovatively developed. Contents of the invention [0004] The object of the present invention is to use the principle of semiconductor heat pump to transfer heat and ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to use the principle of semiconductor heat pump to transfer heat and cool down, so as to cool down the area in a limited space, and solve the problem of poor independent heat dissipation effect of notebook computers

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