A PCB defect detection method based on depth information

A PCB board and defect detection technology, applied in image data processing, instruments, calculations, etc., can solve problems such as slow processing speed, excessive data volume, high false detection rate, etc., to reduce false detection rate, reduce data volume, Effects that require low light conditions

Pending Publication Date: 2019-05-31
SUZHOU JIANGAO OPTOELECTRONICS TECH
View PDF8 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, PCB board defect detection in the industry is mostly based on the two-dimensional color image information of the PCB board. The data volume in the two-dimensional color image is too large and there is a lot of useless information, and the processing speed is slow. Low, high false detection rate, by extracting the color, corner points and other features of the two-dimensional image, and then comparing with the standard board, the defects in the PCB board can be detected

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A PCB defect detection method based on depth information

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0019] Such as figure 1 Shown, a kind of PCB board defect detection method based on depth information, described method comprises the following steps:

[0020] Collect the depth data of the PCB board to be tested and the standard PCB board respectively, use the line laser to scan the front and back of the standard PCB board, and collect the depth data of the front and back of the board;

[0021] According to the depth data of the two PCB boards, corresponding depth images are generated respectively;

[0022] Obtain the standard image according to the depth image of the standard PCB board, obtain the image to be tested according to the depth image of the PCB board to be inspected, perform filtering operation on the obtained depth image to remove n...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a PCB defect detection method based on depth information. The method comprises: acquiring depth data of a PCB to be detected and depth data of a standard PCB; Respectively generating corresponding depth images according to the depth data of the two PCBs; Obtaining a standard image according to the depth image of the standard PCB, and obtaining a to-be-detected image according to the depth image of the to-be-detected PCB; Performing image registration on the standard image and the to-be-detected image; Performing image difference operation on the registered standard image and the to-be-detected image to obtain a binary image; According to the method, the PCB is subjected to three-dimensional scanning through line laser, the depth information of the PCB is obtained, the data size needing to be processed is reduced, the requirement for illumination conditions is low, and the false detection rate can be reduced through three-dimensional depth data processing.

Description

technical field [0001] The invention relates to the field of detection of electronic components, in particular to a method for detecting defects of PCB boards based on depth information. Background technique: [0002] At present, PCB board defect detection in the industry is mostly based on the two-dimensional color image information of the PCB board. The data volume in the two-dimensional color image is too large and there is a lot of useless information, and the processing speed is slow. Low, high false detection rate, by extracting the color, corner points and other features of the two-dimensional image, and then comparing with the standard board, the defects in the PCB board can be detected. Contents of the invention [0003] The object of the present invention is to provide a PCB board defect detection method based on depth information to solve the above-mentioned multiple defects caused in the prior art. [0004] A method for detecting defects in PCB boards based on...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T3/00
Inventor 林斌汪婷
Owner SUZHOU JIANGAO OPTOELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products