Probe card device and its signal conversion module
A technology of probe cards and probes, which is applied in the direction of measuring devices, instruments, and measuring electronics, can solve problems such as poor coplanarity and affect the measurement accuracy of the object to be measured in the probe card device 100a, and improve the coplanarity. The effect of increasing the surface area and improving the measurement accuracy
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Embodiment 1
[0028] Such as figure 2 with image 3 As shown, it is Embodiment 1 of the present invention. This embodiment discloses a probe card device 100, which includes a signal transfer module M, a positioning base 2 located on one side of the signal conversion module M, and a plurality of rectangular probes 3 arranged on the positioning base 2 . Wherein, one end of each rectangular probe 3 abuts against the signal conversion module M, and the other end of each rectangular probe 3 is used for abutting and testing an object under test (such as a semiconductor wafer).
[0029] Furthermore, the signal conversion module M is not limited to be matched with the positioning base body 2 and the rectangular probe 3 . That is to say, in other embodiments not shown in the present invention, the signal conversion module M can also be sold separately or applied to other components. It should be noted that the accompanying drawing of this embodiment is a schematic diagram showing the needle imp...
Embodiment 2
[0041] Such as Figure 4 As shown, it is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the same technical features will not be repeated. The main differences between this embodiment and the above-mentioned first embodiment are as follows.
[0042] Specifically, the connection between each first contact segment 31 and the corresponding electrical contact 12 in this embodiment is a concave-convex fit (such as: a concave-convex fit structure with a tight fit effect) and can be maintained within a relative displacement. are in contact with each other, so that the relative position of each first contact segment 31 and the corresponding electrical contact 12 can be adjusted within the relative displacement; wherein, the relative displacement is less than the elastic compression and is less than 10 microns (preferably 5 microns or less).
[0043] Furthermore, the specific structure of the probe card device 100...
Embodiment 3
[0045] Such as Figure 5 with Image 6 As shown, it is the third embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment two, and the same technical features will not be repeated. The main differences between this embodiment and the above-mentioned embodiment two are as follows.
[0046] Specifically, as Figure 5 As shown, in this embodiment, in each rectangular probe 3 and the corresponding electrical contact 12, the electrical contact 12 protrudes from the board surface 11 of the above-mentioned adapter board 1, and the groove 121 extends from the electrical contact 12. The end surface is formed by concave setting. Wherein, the groove 121 is located outside the board surface 11 of the adapter board 1 in this embodiment, but the present invention is not limited thereto.
[0047] Furthermore, if Image 6 As shown, each rectangular probe 3 can extend and form a plurality of barbs 33 on the side edge of the end portion of the first ...
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Abstract
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