Semi-hole brazing process of semi-conductor laser to base plate
A brazing process and laser technology, which is applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of heat transfer that is difficult to achieve uniform heating, sintering furnace that cannot be evenly distributed, and sintering furnace exhaust dead space, etc., to achieve softening And the solidification process is gentle, the effect of ensuring the quality of brazing and reducing the defective rate
Active Publication Date: 2020-12-11
无锡市博精电子有限公司
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Problems solved by technology
[0005] The existing technical solutions above have the following defects: the sintering furnace is heated by furnace wires, and the furnace wires can only be installed on the inner wall of the sintering furnace, and cannot be evenly distributed in the inner space of the sintering furnace. Difficult to heat evenly
Nitrogen enters from the inner wall of the furnace, and is discharged from the furnace inlet and outlet. Due to the limitation of the nitrogen flow rate and flow direction, there is a dead space in the sintering furnace. It is difficult to completely discharge the original air at the initial stage of sintering, resulting in oxidation
Based on the above reasons, the sockets in the graphite molds that first enter the sintering furnace are often prone to defective products and poor quality
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Embodiment Construction
[0040] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0041] refer to figure 1 , is a semi-hole brazing process of a semiconductor laser TO tube base bottom plate disclosed by the present invention, and the specific steps are as follows:
[0042] S1: Turn on the power switch of the chain-type sintering furnace. The furnace is divided into nine areas, which are arranged in sequence from the furnace inlet to the furnace outlet. Among them, the first three are preheating zones, and the last six are constant temperature zones, and their temperatures are preset as 600°C, 700°C, 800°C, 900°C, 960°C, 975°C, 950°C, 955°C, and 955°C. The allowable error is within the range of ±30°C.
[0043]S2: Furnace temperature measurement, using standard K-type thermocouple indexing table to measure the temperature of nine areas in the sintering furnace, which are displayed by nine corresponding temperature instruments on the sinte...
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The invention belongs to the technical field of TO pipe seat preparation methods, and relates to a semiconductor laser TO pipe seat bottom plate half-hole brazing technology which comprises the stepsof opening a sintering furnace, setting the furnace temperature, metering the furnace temperature, opening nitrogen, starting a caterpillar track, opening cooling water, carrying out pre-reflow initial inspection, sintering in an empty furnace, sintering, drawing a charge, and the like. The semiconductor laser TO pipe seat bottom plate half-hole brazing technology provided by the invention achieves the effects on guaranteeing the sintering quality of a pipe seat and reducing the defective rate through enabling the temperature distribution of various areas in a sintering furnace to be uniform before sintering the pipe seat and completely discharging original air in the sintering furnace.
Description
technical field [0001] The invention relates to the technical field of TO tube base preparation methods, in particular to a semiconductor laser TO tube base half-hole brazing process. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, and have been widely used in industrial, medical and military fields, such as material processing, optical fiber communication, laser ranging, target indication, Laser guidance, laser radar, space optical communication, etc. Most of the existing semiconductor lasers are packaged in TO tube sockets, and the stability of the TO tube sockets directly affects the normal operation of the semiconductor lasers. [0003] At present, the Chinese patent with the notification number CN101888057B discloses a method for preparing a laser diode packaging shell, which includes cleaning before sintering; sintering and sealing processing of the tube base...
Claims
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IPC IPC(8): B23K1/008
Inventor 刘玉堂
Owner 无锡市博精电子有限公司