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A kind of concave electrode type flip chip structure and manufacturing method

An electrode structure, flip-chip technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of tilting and unevenness of LED chips, achieve the effects of reducing tilt, consistent light emitting direction, and improving color mixing uniformity

Active Publication Date: 2021-07-27
XIAMEN CHANGELIGHT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at present, the LED chip will appear tilted or uneven during the welding process with the substrate or bracket.

Method used

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  • A kind of concave electrode type flip chip structure and manufacturing method
  • A kind of concave electrode type flip chip structure and manufacturing method
  • A kind of concave electrode type flip chip structure and manufacturing method

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0039] refer to figure 1 , figure 1 A structural schematic diagram of a concave electrode type flip-chip structure provided by an embodiment of the present invention, the flip-chip structure includes:

[0040] S...

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Abstract

The invention discloses a concave electrode type flip chip structure and a manufacturing method. In the concave electrode type flip chip structure, since the thickness of the first electrode structure and the second electrode structure is smaller than that of the isolation layer Therefore, in the welding process, the soldering agent is filled to the same surface as the isolation layer, thereby improving the smoothness of the welding surface, and solving the problem that the small-chip LED chip is in the welding process with the substrate or bracket. The phenomenon of inclination or unevenness appears, so that the light-emitting surface of the LED chip is flat, and the light-emitting direction is consistent. On the display and visualization products, the effect of consistent light-emitting direction can be achieved, and there will be no polarization phenomenon at a wide viewing angle. In terms of the color mixing effect of the display, the uniformity of color mixing is effectively improved due to the reduced inclination.

Description

technical field [0001] The invention relates to the technical field of flip chips, and more specifically, to a concave electrode type flip chip structure and a manufacturing method. Background technique [0002] With the continuous development of science and technology, various LED chips have been widely used in people's daily life, work and industry, bringing great convenience to people's life. [0003] However, currently, the LED chip may be inclined or uneven during the welding process with the substrate or the bracket. Contents of the invention [0004] In view of this, in order to solve the above-mentioned problems, the present invention provides a concave electrode type flip-chip structure and manufacturing method, the technical scheme is as follows: [0005] A concave electrode type flip-chip structure, the flip-chip structure comprising: [0006] Substrate; [0007] an epitaxial layer structure disposed on the substrate; [0008] A first electrode structure and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/36H01L33/38H01L33/48H01L33/00
Inventor 杨勇志陈帅城李镇勇林锋杰苏丽娣
Owner XIAMEN CHANGELIGHT CO LTD
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