A circuit board assembly and a camera module

A camera module and circuit board technology, applied in the field of photography, can solve problems such as circuit board deformation, and achieve the effect of enhancing structural strength and avoiding deformation

Active Publication Date: 2019-06-07
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a circuit board assembly, which solves the problem that the circuit boar

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  • A circuit board assembly and a camera module
  • A circuit board assembly and a camera module
  • A circuit board assembly and a camera module

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Embodiment Construction

[0026] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] like figure 1 and figure 2 as shown, figure 1 It is a schematic diagram of the cross-sectional structure of the camera module of the specific embodiment provided by the present invention, figure 2 The schematic top view of the circuit board assembly in the specific embodiment provided for the present invention, in the present invention, is all represented by figure 1 Each structural component invo...

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Abstract

The invention discloses a circuit board assembly which comprises a circuit board, a photosensitive chip and a capacitor which are fixed on the circuit board, and a metal base attached to the circuit board; and the metal base is provided with a receding through hole for containing the photosensitive chip and a receding capacitor groove for containing the capacitor. According to the circuit board assembly provided by the invention, the problem that the imaging effect of the photosensitive chip is poor due to the fact that the circuit board is thinner and deformed can be effectively avoided, thephotosensitive chip and the capacitor are isolated from the external environment, the interference of external factors on the photosensitive chip and the capacitor is avoided, and the working performance of the circuit board assembly is improved. And the camera module adopting the circuit board assembly has a better imaging effect, so that the use experience of a user is improved to a greater extent. The invention also discloses a camera module which has the above beneficial effects.

Description

technical field [0001] The invention relates to the field of camera technology, in particular to a circuit board assembly and a camera module. Background technique [0002] At present, in the AF and FF mobile phone camera modules, the photosensitive chip used for imaging generally needs to be attached to the circuit board integrated with the circuit, and the thickness of the circuit board is generally small. As the circuit board is used longer and longer , the circuit board will inevitably be deformed, which will affect the flatness of the photosensitive chip. The flatness of the photosensitive chip directly affects the imaging quality of the image captured by the camera module. Contents of the invention [0003] The object of the present invention is to provide a circuit board assembly, which solves the problem of deformation of the circuit board and improves the imaging quality of the camera module using the circuit board assembly of the present invention. [0004] Ano...

Claims

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Application Information

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IPC IPC(8): H04N5/225G03B17/12H04M1/02
Inventor 赵波杰曾俊杰黄威威
Owner NINGBO SUNNY OPOTECH CO LTD
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