Circuit board automatic loading method and system
An automatic feeding and circuit board technology, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of low efficiency of manual feeding, achieve the effects of reducing labor costs, improving processing efficiency, and reducing labor intensity
Active Publication Date: 2019-06-07
WUXI SHENNAN CIRCUITS CO LTD
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Problems solved by technology
[0003] The main purpose of the present invention is to propose a method for automatic feeding of circuit boards, aiming to solve the technical problem of low efficiency of manual feeding during the baking and manufacturing of circuit boards
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[0044] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work all belong to the protection scope of the present invention.
[0045] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indications are only used to explain the position in a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0046] In addition, if there are descriptions involving "first", "second" and ...
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The present invention discloses a circuit board automatic loading method and system. The circuit board automatic loading method comprises the steps of: controlling a material gripping device to grip asubstrate to be baked put on a loading platform; controlling the substrate to be baked to rotate to a non-horizontal state; and putting the substrate to be baked into a clamping position of a clamping frame to clamp the substrate to be baked in the clamping frame. The loading method can achieve that the substrate to be baked is put in the clamping frame to improve the automation and mechanizationdegrees of loading so as to improve the processing efficiency in the process of baking and manufacturing the circuit board, reduce the operators' labor intensity and reduce the labor cost. After thesubstrate to be baked is rotated to the non-horizontal state, the substrate to be baked is clamped in the clamping frame in a non-horizontal mode to improve the force condition of the substrate to bebaked in the clamping frame and prevent the middle portion of the substrate to be baked itself from drooping due to the gravity of the substrate to be baked so as to prevent the substrate to be bakedfrom being bent and even being folded and damaged.
Description
technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board automatic feeding method and system. Background technique [0002] During the process of circuit board processing, it is usually necessary to bake the circuit board. At present, in the baking and manufacturing process of circuit boards, manual operations are mostly used. For example, when the circuit board is put into the oven, it is necessary to manually place the substrate to be baked in the clamping frame, and then place the substrate to be baked in the frame. The clip frame is placed in the oven; thus, not only the processing efficiency is low, but also the labor intensity of the operator is high. Contents of the invention [0003] The main purpose of the present invention is to propose a method for automatic feeding of circuit boards, aiming to solve the technical problem of low efficiency of manual feeding during the baking and manufactur...
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IPC IPC(8): H05K3/00B65G47/90
Inventor 韦助昌杨智勤刘成勇张建
Owner WUXI SHENNAN CIRCUITS CO LTD