Unlock instant, AI-driven research and patent intelligence for your innovation.

Selecting a set of locations associated with a measurement or feature on a substrate

An associative, part-based technique applied in the field of computer programs

Active Publication Date: 2019-06-07
ASML NETHERLANDS BV
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Known methods cannot achieve cross-wafer and cross-field sampling while being flexible enough to handle the above constraints

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Selecting a set of locations associated with a measurement or feature on a substrate
  • Selecting a set of locations associated with a measurement or feature on a substrate
  • Selecting a set of locations associated with a measurement or feature on a substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] figure 1 A lithographic apparatus LA according to an embodiment of the invention is schematically depicted. The equipment includes:

[0034] i. An illumination system (illuminator) IL configured to condition a radiation beam B (eg UV radiation or EUV radiation).

[0035] ii. a support structure (e.g. a mask table) MT configured to support a patterning device (e.g. a mask) MA and connected to a first positioner PM configured to accurately position the patterning device according to certain parameters;

[0036] iii. A substrate table (e.g. wafer table) WTa or WTb configured to hold a substrate (e.g. a resist-coated wafer) W and connected to a first stage configured to accurately position the substrate according to certain parameters two positioners PW; and

[0037] iv. A projection system (eg a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion C of the substrate W (...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for selecting an optimal set of locations for a measurement or feature on a substrate includes: (302) defining constraints, and optionally cost function(s); (306) defining a first candidate solution of locations; (308) defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution (this may involve duplication, mutation and cross-over); (310) determining a value of a cost function associated with a required measurement accuracy or feature layout on the substrate; (312) selecting the first and / or second candidate solution as the optimal solution according to a constraint associated with the substrate and optionally according to the value of the cost function; (314) ending the iterations, if the constraints are satisfied and the value of a cost function has converged, or if a number of iterations has been reached.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from EP application 16193903.8, filed October 14, 2016, and EP / US application 17160587.6, filed March 13, 2017, both of which are hereby incorporated by reference in their entirety. technical field [0003] The invention relates to a method of selecting an optimal solution comprising an optimal set of locations associated with measurements or features on a substrate, an associated device and a computer program. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to create the circuit pattern to be formed on the individual layers of the IC. The pattern may be transferred onto a target po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/02G03F7/207G03F9/00G03F7/00G03F7/20
CPCG03F7/705G03F9/7026G03F7/70616G03F9/7076G03F7/70641G03F9/7046G03F9/7084Y02P90/02
Inventor P·弗朗西斯科S·P·马特瓦J·S·怀登伯格
Owner ASML NETHERLANDS BV