Novel computer radiator

Abstract

The invention discloses a novel computer radiator. The radiator comprises a radiator body, the radiator body is fixed with the fan body through the positioning holes by bolts; a rotating shaft is arranged in the fan body; heat dissipation blades are arranged on the outer surface of the rotating shaft; a rotating shaft hole is formed in the fixed bearing; an anti-abrasion pad is arranged on the inner surface of the rotating shaft hole; a heat insulation plate is arranged at the bottom end of the fan body; wherein radiating fins are arranged in the radiator body; Positioning foot pads are arranged on the two sides of the outer surface of the radiator body. A mounting base is arranged below the radiator body, a pressing rubber pad is arranged below the mounting base, a shock pad is arranged at the top end of the mounting base, a heat conducting piece and a limiting groove are formed in the upper surface of the shock pad, the heat conducting piece is located in the center of the upper surface of the shock pad, and the limiting grooves are located in the two sides of the heat conducting piece. According to the radiator, the overall structural design is simple and reasonable, the mounting and dismounting flexibility is high, and the practicability of the radiator is improved.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a novel computer radiator. Background technique [0002] High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The role of the radiator is to absorb the heat and then radiate it to the inside or outside of the chassis to ensure that the temperature of the computer components is normal. Heat sinks are required, and these different heat sinks cannot be mixed, and the one we most often come into contact with is the CPU heat sink. According to the way heat is taken away from the radiator, the radiator can be divided into active cooling and passive cooling. The former is common for air-cooled radiators, while the latter is common for heat sinks. Further subdividing heat dissipation methods can be divided into air cooling, heat pipe, liquid cooling,...

AI Technical Summary

Problems solved by technology

[0003] However, the existing computer heat sinks still have certain deficiencies. They are cumbersome in the process of installation and disassembly, and consume a certain amount of manpower. At the same time, the uniformity of heat circulation cannot be guaranteed when the heat dissipation blades rotate, which brings a negative impact on the normal operation of the heat sink. Certain potential safety hazards limit the development of computer radiators

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