A kind of rapid feeding device and feeding method for tube base for semiconductor laser

Abstract

The invention discloses a quick installing device of a tube socket applied to a semiconductor laser device. The device comprises a base, a mould strip, an elastic plate and an elastic plate driving mechanism. According to the device, the tube socket required to be installed in the mould strip is placed in a tray, and the mould strip is installed in a slot in the base; the elastic plate is driven by the elastic plate driving mechanism to slide upwards through a sliding mechanism till openings in the elastic plate and tube socket holes are coaxial, and the tube socket is installed in all the tube socket holes of the mould strip through tweezers; then the elastic plate is driven by the elastic plate driving mechanism to slide downwards, and the elastic plate tightly presses the upper end of the tube socket in the tube socket holes; and finally the mould strip filled up with the tube socket is taken out of the base. In his way, production speed is greatly increased, time is saved, the quantity of installing personnel is reduced, manpower is saved, the manual amount is reduced, and the effect of getting a twofold result with half the effort is achieved. The whole installing device is small in size, simple in structure, easy to process and low in production cost.

Description

technical field [0001] The invention relates to the technical field of LD packaging, in particular to a machine loading method for a fast loading device for a semiconductor laser socket. Background technique [0002] After decades of development, semiconductor lasers have become more and more well-known to the society and have been applied in many fields. The photoelectric conversion efficiency of semiconductor lasers is above 60%, which is much higher than that of other similar products. The advantages of low energy consumption, less heat accumulation in the device, long life, good collimation, and long lighting distance are more and more widely used as an emerging technology in similar industries in society. The various advantages of semiconductor lasers determine that they are getting more and more attention from all walks of life. [0003] Semiconductor lasers need to be packaged through multiple processes in the production process, but the appearance characteristics an...

AI Technical Summary

Problems solved by technology

However, this method of dismantling is too cumbersome, and the pushing device is connected by a cylinder, which cannot guarantee the uniform speed of dismantling, which may cause excessive thrust during the dismantling process and disturb the pipe seat on the mold strip

Moreover, the mold bar pusher used is too complicated to manufacture, and the processing cost is too high, which is not conducive to mass production

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