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Multi-scale nano-silver paste mixed with nano-silver particles and silver-plated silicon carbide particles and preparation method thereof

A technology of silicon carbide particles and nano-silver particles, which is applied in the fields of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of unsatisfactory semiconductor matrix interconnection, affecting heat dissipation effect, and material brittleness. , to achieve the effect of low thermal expansion coefficient, reduce porosity and improve performance

Active Publication Date: 2021-02-23
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silicon carbide has thermal conductivity comparable to silver, but the price of silicon carbide is several times lower than that of silver. It is a low-cost thermal conductivity material that is expected to replace silver particles. In addition, silicon carbide also has many excellent properties, such as high hardness, High strength, good creep resistance, chemical corrosion resistance, good oxidation resistance, small thermal expansion coefficient, high thermal conductivity, etc., but the sintering temperature of silicon carbide particles is high, the porosity after sintering is high, and the material after sintering silicon carbide particles High brittleness, the interconnection with the semiconductor substrate is not ideal, which affects the heat dissipation effect

Method used

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  • Multi-scale nano-silver paste mixed with nano-silver particles and silver-plated silicon carbide particles and preparation method thereof
  • Multi-scale nano-silver paste mixed with nano-silver particles and silver-plated silicon carbide particles and preparation method thereof
  • Multi-scale nano-silver paste mixed with nano-silver particles and silver-plated silicon carbide particles and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] In this example, see Figure 1-Figure 3 A method for preparing a multi-scale nano silver paste mixed with silver nano particles and silver-plated silicon carbide particles, comprising the steps of:

[0033] a. Add 30ml of absolute ethanol as the base solvent to the beaker, put it on a heating platform and heat it to 60°C, use a balance to weigh 0.8g of polyvinyl butyral, and add polyvinyl butyral to the beaker while stirring Aldehyde, polyvinyl butyral and ethanol are fully mixed to form a carrier solvent, which is ready for use; the heating temperature is lower than the boiling point of ethanol, which reduces the volatilization of ethanol, saves solvents, reduces solvent consumption, and is beneficial under heating conditions Uniform mixing of polyvinyl butyral polymer in ethanol base solvent;

[0034] b. lower the temperature of the mixed carrier solvent prepared in step a, after cooling to room temperature, put the beaker on the balance, add 0.08g triethylene glycol...

Embodiment 2

[0039] This embodiment is basically the same as Embodiment 1, especially in that:

[0040] In this example, see Figure 1-Figure 3 A method for preparing a multi-scale nano silver paste mixed with silver nano particles and silver-plated silicon carbide particles, comprising the steps of:

[0041] a. Add 30ml of absolute ethanol as the base solvent to the beaker, put it on a heating platform and heat it to 60°C, use a balance to weigh 0.444g of polyvinyl butyral, and add polyvinyl butyral to the beaker while stirring Aldehyde, polyvinyl butyral and ethanol are fully mixed to form a carrier solvent, which is ready for use; the heating temperature is lower than the boiling point of ethanol, which reduces the volatilization of ethanol, saves solvents, reduces solvent consumption, and is beneficial under heating conditions Uniform mixing of polyvinyl butyral polymer in ethanol base solvent;

[0042]b. lower the temperature of the mixed carrier solvent prepared in step a, after co...

Embodiment 3

[0047] This embodiment is basically the same as the previous embodiment, and the special features are:

[0048] In this example, see Figure 1-Figure 3 A method for preparing a multi-scale nano silver paste mixed with silver nano particles and silver-plated silicon carbide particles, comprising the steps of:

[0049] a. Add 30ml of absolute ethanol as the base solvent to the beaker, put it on a heating platform and heat it to 60°C, use a balance to weigh 0.8g of polyvinyl butyral, and add polyvinyl butyral to the beaker while stirring Aldehyde, polyvinyl butyral and ethanol are fully mixed to form a carrier solvent, which is ready for use; the heating temperature is lower than the boiling point of ethanol, which reduces the volatilization of ethanol, saves solvents, reduces solvent consumption, and is beneficial under heating conditions Uniform mixing of polyvinyl butyral polymer in ethanol base solvent;

[0050] b. lower the temperature of the mixed carrier solvent prepared...

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Abstract

The invention discloses a multi-scale nano-silver paste mixed with nano-silver particles and silver-plated silicon carbide particles and a preparation method of the same and relates to a novel interface interconnection material, in particular to a multi-scale nano-silver paste added with silver-plated silicon carbide particles. A formula and a preparation process of the multi-scale nano-silver paste are included. The multi-scale nano-silver paste is prepared by using triethylene glycol, polyvinyl butyral, terpilenol, nano-silver particles and submicron silver-plated silicon carbide particles,and the components in percentage by mass are of 0.5-1.2% of triethylene glycol, 5.6-12.2% of polyvinyl butyral, 3.89-8.56% of terpilenol, 76-90% of nano-silver particles and 0.5-2% of submicron silver-plated silicon carbide particles. According to the multi-scale nano-silver paste and the preparation method in the invention, the silicon carbide particles are used for replacing part of the nano-silver particles to be added into the silver paste, so that the porosity of the silver paste after being sintered is reduced, the performance of the silver paste is improved, the cost of the nano silverpaste is reduced, and the performance of the silver paste after being sintered is improved.

Description

technical field [0001] The invention relates to a nano-silver material and a preparation method thereof, in particular to a nano-silver paste and a preparation method thereof, which are applied in the field of interface interconnection materials and process technology. Background technique [0002] With the development of semiconductor technology, chip output power increases, frequency increases, electronic products tend to be miniaturized, especially the emergence of new silicon carbide integrated circuit chips that can work in high temperature environments above 250 ° C, making the ambient temperature of chip work The high temperature will lead to solder remelting and affect its reliability, and the low thermal conductivity of traditional interface materials can no longer meet the heat dissipation requirements of high power density packaging systems. Due to its excellent performance, it has become the most promising interface interconnection material at present. [0003] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00B82Y30/00
Inventor 张俏然刘建影路秀真
Owner SHANGHAI UNIV