A wafer fixing table and wafer bonding equipment
A wafer fixing and wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of affecting the stability of the wafer on the fixed table, affecting the wafer bonding effect, and the wafer cannot be tightly bonded And other issues
Active Publication Date: 2021-09-14
YANGTZE MEMORY TECH CO LTD
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Problems solved by technology
[0003] In this field, it is usually necessary to fix the wafer on the wafer fixed table when performing various process operations such as processing on the wafer, and the stability of the wafer on the fixed table is one of the important factors affecting the success or failure of the process; especially for Wafer bonding technology, if the wafer to be bonded cannot be stably fixed on the fixed table, it will seriously interfere with the alignment accuracy of the two wafers, and ultimately affect the wafer bonding effect
[0004] Usually, after the wafer goes through a complex process, such as the bevel etch process, the edge area of the crystal back (ie, the back of the wafer) will be damaged to a certain extent, so that the wafer cannot be tightly attached to the fixed table. , which directly affects the stability of the wafer on the fixed table
Method used
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[0039] As an implementation manner, the sealing ring 22 is specifically the outermost sealing ring 221 .
[0040] As an embodiment, there are multiple screws 23 , and the multiple screws 23 are uniformly arranged on the outer circumference of the sealing ring 22 .
[0041] As an embodiment, several pairs of adjusting pieces 2212 protruding from the outer circumference are provided on the outer circumference of the sealing ring 22, and the threaded holes 2214 are opened on the adjusting pieces 2212; A sealing gasket 2213 extending along the circumferential direction of the sealing ring 22 is disposed inside the adjusting piece 2212 .
[0042] It can be understood that a pair of sealing pads 2213 may be provided at each location where the screw rod 23 is provided on the circumference; in the initial / natural state (unstressed state), the pair of sealing pads 2213 are separated from each other by a certain distance, When the sealing ring 22 is shrunk (the screw rod 23 exerts forc...
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Abstract
The invention discloses a wafer fixing table, comprising a tray and a sealing ring, the tray is used to carry a wafer; the sealing ring is located on the tray and is used to seal the gap between the tray and the wafer The gap between; wherein, the size of the sealing ring is adjustable along the radial direction.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer fixing table and wafer bonding equipment. Background technique [0002] Wafer bonding technology refers to the tight bonding of two polished wafers; this technology is widely used in 3D integrated circuits and micro-mechanical systems, and continues to promote the rapid development of the semiconductor industry. [0003] In this field, it is usually necessary to fix the wafer on the wafer fixed table when performing processing and other process operations on the wafer, and the stability of the wafer on the fixed table is one of the important factors affecting the success or failure of the process; especially for For wafer bonding technology, if the wafer to be bonded cannot be stably fixed on the fixed table, it will seriously interfere with the alignment accuracy of the two wafers, and ultimately affect the wafer bonding effect. [0004] Usually, after the wafer ...
Claims
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IPC IPC(8): H01L21/683H01L21/67
Inventor 邢瑞远丁滔滔王家文刘孟勇刘武陈国良
Owner YANGTZE MEMORY TECH CO LTD