Cutting method of chip

Abstract

The application provides a cutting method of a chip. The cutting method comprises the following steps: performing cutting at a predetermined region of a back of the chip by adopting laser to obtain acutting groove; performing etching at the predetermined region of a front of the chip by adopting a plasma etching method to obtain multiple chip units; wherein the projection of the predetermined region at the front of the chip on the back of the chip coincides with the predetermined region at the back of the chip. In the cutting method disclosed by the invention, the heat produced by laser cutting is less since the laser cutting is only performed on partial thickness of the chip from the back, the performance of the chip basically cannot be influenced, the partial thickness of the front of the chip is etched by adopting the plasma with smaller damage, so that the effective utilization area of the wafer is increased; the problem that the chip performance is changed even failed since the chip is cut into multiple units by adopting the laser can be avoided, the good performance of each chip unit formed by cutting is guaranteed.

Description

technical field [0001] The present application relates to the field of semiconductors, and in particular, relates to a chip cutting method. Background technique [0002] After the chip is processed on the wafer, it needs to be separated into units. Nowadays, mechanical cutting and laser cutting are mainly used to realize it. However, these two technologies have certain limitations, which will have a certain impact on the performance or yield of the product. For example, mechanical dicing will inevitably cause damage to the wafer structure, wasting the area of ​​the wafer, and if the damage area is too large, the chip function may fail. Although laser cutting has little damage, the heat generated by the laser may cause chip performance to change or even fail. [0003] The above information disclosed in the Background section is only to enhance the understanding of the background of the technology described herein, therefore, the Background may contain certain information whi...

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Problems solved by technology

[0004] The main purpose of this application is to provide a chip cutting method to solve the problem that the laser cutting method in the prior art easily leads to chip failure

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