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Image sensor, manufacturing method thereof, and electronic device

An image sensor and circuit technology, applied in the field of image sensors, can solve the problems of high total chip cost, complex process, high cost per unit area, etc.

Active Publication Date: 2021-08-13
SHENZHEN GOODIX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The signal processing unit includes a variety of device types and requires more complex processes, so the unit area cost of the signal processing unit is relatively high
In existing image sensor chips, the cost per unit area of ​​the chip is generally determined by the cost per unit area of ​​the signal processing unit, and the total cost of the chip is relatively high

Method used

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  • Image sensor, manufacturing method thereof, and electronic device
  • Image sensor, manufacturing method thereof, and electronic device
  • Image sensor, manufacturing method thereof, and electronic device

Examples

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Embodiment Construction

[0057] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0058] It should be understood that the specific examples herein are only intended to help those skilled in the art better understand the embodiments of the present application, rather than limit the scope of the embodiments of the present application.

[0059] It should also be understood that in various embodiments of the present application, the sequence numbers of the processes do not mean the order of execution, and the execution order of the processes should be determined by their functions and internal logic, and should not be used in the embodiments of the present application. The implementation process constitutes any limitation.

[0060] It should also be understood that the various implementation manners described in this specification can be implemented alone or in combination, which is not limited in the embodiments of...

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Abstract

An image sensor, a manufacturing method thereof, and an electronic device capable of reducing the cost of the image sensor. The image sensor includes: a pixel array module disposed on the first wafer; a signal processing module disposed on the second wafer; an electrical connection module connected to the pixel array module and the signal processing module; wherein, the The pixel array module is used to receive light signals and convert the light signals into electrical signals, and the signal processing module is used to process the electrical signals.

Description

technical field [0001] The present application relates to the field of image sensors, and more particularly, relates to an image sensor, a manufacturing method thereof, and an electronic device. Background technique [0002] With the development of semiconductor and integrated circuit technology, the device types of chips are becoming more and more abundant, the process requirements are getting higher and higher, and the number of process layers produced is also increasing, so the cost of chips is getting higher and higher. Since the device type and process complexity of each part of the chip affect the overall chip cost, the unit area cost of the overall chip is determined by the part corresponding to the highest unit area cost. [0003] An image sensor chip includes a pixel array unit and a signal processing unit, wherein the pixel array unit occupies most of the area of ​​the chip, while the signal processing unit occupies a relatively small area. Generally, the pixel ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/369H04N5/374H01L27/146
CPCH01L27/14634H01L27/14636H01L27/1469H04N25/79H04N25/78H04N25/75
Inventor 詹昶
Owner SHENZHEN GOODIX TECH CO LTD