Enhanced cooling device having PCM packaged particles and method

Abstract

An enhanced cooling device having PCM packaged particles and a method belong to the field of energy power. The cooling device has a plurality of packaged PCM particles (3). During operation, air enters the device from an air inlet (1) at the bottom of the device through a distributor (2), and drives PCM (phase change material) particles in a cavity (4) in the device to flow in a fountain-like shape in the device. During the flowing process, the PCM particles and the hot wall surface (5) of the device collide with each other to perform heat exchange, thereby achieving a purpose of enhancing theheat transfer. When the hot wall surface (5) of the device is in an intermittent high-load condition, the PCM in the PCM particles (3) is subjected to a phase change when the temperature rises to a certain degree so as to achieve a buffer effect in intermittent high-load condition. The cooling device is suitable for occasions such as electronic heat dissipation where the volume of the cooling device is limited and the intermittent high-load condition occurs.

Description

technical field [0001] The invention relates to an enhanced heat dissipation device and method containing PCM encapsulation particles, which belong to the field of energy and power. Background technique [0002] With the continuous development of integrated circuits, electronic equipment has developed rapidly in the direction of high performance and miniaturization in the past few decades. There is a famous "Moore's Law" in the chip industry, that is, the number of transistors that can be accommodated on a chip doubles every 18 months. As the number of integrated transistors on a chip continues to increase, the heating power of the chip and the density of transistors inside the chip are also increasing, and the problem of chip heat dissipation is becoming more and more prominent. High temperature is one of the main factors leading to thermal failure of electronic components. Due to the miniaturization of electronic components, they are often located in a closed and limited ...

AI Technical Summary

Problems solved by technology

According to data, when the chip heat flux is greater than 0.078W / cm 2 Generally, it is necessary to consider the cooling method of forced air convection, but when the heat flux density is greater than 80W / cm 2 At the same time, if the cooling method of forced air convection is still used, the air volume and air pressure of the fan are required to be high, which will make the fan noise when it is running. Not only that, the thermal shock problem caused by the chip under intermittent high load Air-cooled radiators also require an unsatisfactory balance between cost, space, and comfort

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