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A Chip Picking Device with Adjustable Function and Good Clamping Effect

A pick-up equipment and clamping technology, which is applied in the direction of transportation and packaging, conveyor objects, etc., can solve the problems of unstable suction cup adsorption, inability to suck chips, chip damage, etc., achieve good clamping effect and improve practicability

Active Publication Date: 2020-12-18
嘉兴觅特电子商务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of chip picking, it is difficult to accurately control the suction force of the suction cup. If the suction force is too large, it is easy to squeeze the chip too much and cause damage to the chip. The center is offset, resulting in unstable chuck attachment, which reduces the practicality of existing chip picking equipment

Method used

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  • A Chip Picking Device with Adjustable Function and Good Clamping Effect
  • A Chip Picking Device with Adjustable Function and Good Clamping Effect
  • A Chip Picking Device with Adjustable Function and Good Clamping Effect

Examples

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Embodiment Construction

[0025] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0026] Such as figure 1 As shown, a chip pickup device with a good clamping effect with an adjustment function includes a mounting plate 1, an adjustment mechanism, an adjustment plate 2, a vertical rod 3, a processor 4, a bottom plate 5, a camera 34 and a clamping mechanism. The mounting plate 1, the adjusting mechanism, the adjusting plate 2, the vertical bar 3, the bottom plate 5 and the camera 34 are arranged sequentially from top to bottom, the processor 4 is fixed under the adjusting plate 2, and the processor 4 is provided with a PLC, The camera 34 is electrically connected to the PLC;

[0027] When using the chip pick-up device, after the mounting pl...

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PUM

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Abstract

The invention relates to a chip pickup device with an adjusting function and a good clamping effect. The chip pickup device comprises a mounting plate, an adjusting mechanism, an adjusting plate, a vertical rod, a processor, a bottom plate, a camera and a clamping mechanism, wherein the adjusting mechanism comprises a first motor, a turntable, an adjusting assembly, an adjusting block and a telescopic assembly; the adjusting assembly comprises a second motor, a bearing, a screw rod; the clamping mechanism comprises an air cylinder, a lifting plate and two clamping assemblies; and the clampingassemblies include inclined rods, supporting rods, rotating rods and supporting plates. The chip pickup device with the good clamping effect and the adjusting function can drive the adjusting plate tomove through the adjusting mechanism to change the position of the bottom plate so that the camera can be positioned over chips, and then the chips are convenient to pickup through the device; more than that, the clamping mechanism is used to drive the supporting plates to rotate below the chips, so that the chips are supported from below by the supporting plates; the positions of the chips are fixed through a fastening unit to complete the pickup, then the clamping effect is ensured; and thus, the practicability of the device is improved.

Description

technical field [0001] The invention relates to the field of chip pick-up equipment, in particular to a chip pick-up device with an adjustment function and good clamping effect. Background technique [0002] Integrated Circuit (Integrated Circuit, IC), also known as microchip, chip or chip, is a way of miniaturizing circuits (including semiconductor devices, including passive components, etc.) in electronics, and is often manufactured on semiconductor wafers surface. [0003] After the chip is produced, it needs to be picked up. When picking up, the thimble is usually used to pass through the protective film under the chip, and the chip is lifted upwards, so that the chip is detached from the protective film, and then the suction cup sucks the chip up to complete the process. Pick up work. However, in the process of chip picking, it is difficult to accurately control the suction force of the suction cup. If the suction force is too large, it is easy to over-squeeze and cau...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/91B65G47/92
Inventor 张晓奎
Owner 嘉兴觅特电子商务有限公司
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