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Trapezoidal organosilicon polymer, preparation method and application thereof, and LED encapsulation glue

A technology of LED encapsulation and silicone, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of difficult sealing, difficult control of polymerization degree, limited heat resistance, etc., and achieve good cold Effects of thermal shock resistance, good application prospects, and high vulcanization resistance

Active Publication Date: 2022-01-04
北京科化新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Cao Xinyu et al. (CN104045831A) disclose a kind of siloxane bridging ladder polysiloxane and its preparation method, which has the characteristics of excellent heat resistance, good mechanical properties, etc., but it has the following problems: general capping The structure of the agent (monofunctional silane) is single, which limits its heat resistance, and the end capping is not easy to complete, and the degree of polymerization is also difficult to control, which limits its application.

Method used

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  • Trapezoidal organosilicon polymer, preparation method and application thereof, and LED encapsulation glue
  • Trapezoidal organosilicon polymer, preparation method and application thereof, and LED encapsulation glue
  • Trapezoidal organosilicon polymer, preparation method and application thereof, and LED encapsulation glue

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0071] This preparation example is used to illustrate the ladder-shaped silicone polymer provided by the present invention.

[0072] (1) Under the protection of dry nitrogen, add 59.5g of phenyltrimethoxysilane (0.3mol), 32.4g of diphenylsilane di Alcohol (0.15mol) and 90g of DMA were stirred evenly and placed at -15°C, 0.1g of DBU was added, and intermediate 1 (monomer) was obtained after 8 hours of reaction.

[0073] (2) At the same time, add 17.2g methylvinyldimethoxysilane (0.12mol), 13g diphenyl Silanediol (0.06mol) and 15g of DMA were stirred evenly and placed at 0°C, 0.6g of DBN was added, and intermediate 2 (capping agent) was obtained after 24 hours of reaction.

[0074] (3) Mix the obtained intermediate 2 with intermediate 1, put it at 0°C, add 12.96g of water (0.72mol), and react under reduced pressure (the pressure is continuously reduced from 0.1MPa to about 0.085MPa) for 20h Finally, add formic acid to neutralize, then add 60g toluene to dissolve the product, a...

preparation example 2

[0080] This preparation example is used to illustrate the ladder-shaped silicone polymer provided by the present invention.

[0081] (1) Under the protection of dry nitrogen, add 59.5g of phenyltrimethoxysilane (0.3mol), 32.4g of diphenylsilane di Alcohol (0.15mol) and 90g of DMF were stirred evenly and placed at -15°C, then 0.1g of DBN was added, and intermediate 1 (monomer) was obtained after 8 hours of reaction.

[0082] (2) At the same time, add 40.3g methyldiethoxysilane (0.3mol), 32.4g diphenyl Silanediol (0.15mol) and 30g of DMA were stirred evenly and placed at -20°C, 1.5g of dibutylamine was added, and intermediate 2 (capping agent) was obtained after 8 hours of reaction.

[0083] (3) Mix the obtained intermediate 2 with intermediate 1, put it at 0°C, add 16.2g of water (0.9mol), and react under reduced pressure (the pressure is continuously reduced from 0.1MPa to about 0.08MPa) for 10h Add formic acid to neutralize afterward, then add 80g toluene lysate, add water ...

preparation example 3

[0086] This preparation example is used to illustrate the ladder-shaped silicone polymer provided by the present invention.

[0087] (1) Under the protection of dry nitrogen, add 59.5g of phenyltrimethoxysilane (0.3mol), 32.4g of diphenylsilane di Alcohol (0.15mol) and 90g ethylene glycol methyl ether were stirred evenly and then placed at -15°C, 0.1g triethylenetetramine was added, and intermediate 1 (monomer) was obtained after 10 hours of reaction.

[0088] (2) At the same time, add 13.9 g of 3-methacryloyloxypropylmethyldimethoxy to another three-necked flask equipped with dry nitrogen protection, mechanical stirring, constant pressure dropping funnel and reflux condenser Silane (0.06mol), 6.5g diphenylsilanediol (0.03mol) and 10g tetrahydrofuran were stirred evenly and then placed at 30°C, 0.2g potassium tert-butoxide was added, and intermediate 2 (capping agent ).

[0089] (3) Mix the obtained intermediate 2 with intermediate 1, put it at 0°C, add 11.9g of water (0.66m...

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Abstract

The invention relates to the field of LED encapsulation, and discloses a trapezoidal organosilicon polymer, a preparation method and application thereof, and an LED encapsulation adhesive. The ladder-shaped silicone polymer has a structure shown in formula (I), wherein m1-m5 is 1-5; n, p and q are 0-100, and n, p and q are not 0 at the same time; R 1 , R 2 , R 1 ’, R 2 ’, R 1 ", R 2 ", R 1 "', R 2 "', R 1 "" and R 2 "" are independently C 2 -C 25 Alkyl or aryl; R 3 -R 16 is hydrogen, hydroxyl, alkenyl, acyloxy, epoxy, mercapto, thiocyanate, isocyanate, phenyl, acryloyloxy, epoxyalkoxy, C 1 -C 3 Alkyl groups and their derivatives. The encapsulation material obtained from the trapezoidal silicone polymer of the invention has suitable hardness, strong high temperature resistance, high vulcanization resistance, high moisture resistance and good cold and heat shock performance, and has good application prospects.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a trapezoidal silicone polymer, a preparation method and application thereof, and an LED packaging adhesive. Background technique [0002] LED (light-emitting diode) lamps have the advantages of high efficiency, energy saving, green environmental protection, etc., and their prospects in the lighting market have attracted the attention of various countries. With the continuous improvement of LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved, and there are higher requirements for the performance of packaging materials. High-power and high-performance packaging materials have become a development trend. At present, there is a big gap between domestic research on high-power and high-performance LED packaging materials compared with foreign countries, and packaging companies cannot meet the use requirements. Therefore, it can only rely...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/44C08G77/06C08G77/14C08G77/20C09J183/07C09J183/04C09J183/06C09J11/06
CPCC08G77/44C08G77/06C08G77/14C08G77/20C09J183/04C09J183/06C09J11/06C08G77/80C08K5/1345
Inventor 张琛王聪王锐李海亮张榕本方世璧
Owner 北京科化新材料科技有限公司