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A method and device for configuring and selecting measuring points

A technology of configuration selection and device configuration, which is applied in the direction of photolithography process exposure device, pattern surface photolithography process, microlithography exposure equipment, etc., can solve the problems of too dense distribution, lack of measurement point distribution, etc., and reach the measurement point evenly distributed effect

Active Publication Date: 2021-08-10
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the same fixed number of measurement points and position distribution are used for each exposure unit, the distribution of measurement points 111 on the final wafer 100 will be too dense and lack the distribution of measurement points for specific purposes.

Method used

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  • A method and device for configuring and selecting measuring points
  • A method and device for configuring and selecting measuring points
  • A method and device for configuring and selecting measuring points

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0062] see image 3 , which is a flow chart of the steps of the method for selecting the configuration of measurement points in Embodiment 1 of the present invention. The first embodiment provides a method for selecting a configuration of a measurement point, including the following steps:

[0063] S110: Determine the quantity and distribution positions of measurement points in the multiple exposure units.

[0064] In this step S110, the number and distribution positions of the measuring points are firstly set. For example, set the number of measurement points to 13, and the distribution positions are as follows Figure 4 As shown, 8 measuring points are set on the outer edge of the rectangle, and 5 measuring points are set inside the rectangle. It should be noted that, in this step S110, the number and distribution positions of the measurement points may be adjusted.

[0065] S120: Divide the measurement points into various measurement point groups according to the distri...

Embodiment 2

[0073] Embodiment 2 provides a device for implementing the measurement point configuration method in Embodiment 1 above. Please combine Figure 13 , which is a schematic diagram of a device configured with measurement points in Embodiment 2. The embodiment of the present invention also provides a configuration device for measuring points, including:

[0074] A setting unit 310 is configured to determine the quantity and distribution positions of measurement points in the exposure unit 210 .

[0075] The division unit 320 is configured to divide the measurement points into various measurement point groups according to the distribution positions of the measurement points.

[0076] Specifically, each measurement point group includes at least three measurement points, and the three measurement points in the same measurement point group are not on the same straight line.

[0077] Wherein, the number of measurement points in each measurement point group is the same but the distri...

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Abstract

The present invention proposes a method and device for configuring and selecting measuring points. The method includes the following steps: determining the number and distribution positions of measuring points in multiple exposure units; dividing the measuring points into A variety of measurement point groups; and assigning a measurement point group to the exposure unit, and setting a corresponding measurement point for each exposure unit according to the measurement point group, wherein the two adjacent positions The measuring point positions of the exposure units are not adjacent. By means of group division, different measurement point groups are assigned to the exposure units, and there is no close measurement point between two adjacent exposure units, so that the distribution of measurement points on the entire wafer is more uniform.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method and device for configuring and selecting measuring points. Background technique [0002] The photolithography process is used in the semiconductor manufacturing process. The photolithography process is to transfer the circuit structure in the form of a pattern on the mask (Mask) to the surface of the wafer coated with photoresist through steps such as alignment, exposure, and development, so that A layer of photoresist masking pattern is formed on the circular surface. [0003] Semiconductor devices are made up of many overlapping layers of circuits, so dozens of photolithography steps are required. It is necessary to ensure that each layer is aligned with the front and rear layers, that is, overlay. Overlay errors will directly affect the quality of semiconductor devices. performance, or even cause a short circuit to cause device failure. [0004] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70616G03F7/7085
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC