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An on-chip antenna and antenna array

An on-chip antenna and patch antenna technology, which is applied in the direction of antenna, antenna grounding device, antenna grounding switch structure connection, etc., can solve the problems of difficult setting of antenna unit and CMOS structure, and achieve good engineering realization and high feeding efficiency Effect

Active Publication Date: 2021-04-09
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The size parameters of traditional millimeter-wave antennas are at the millimeter level, and the size and dimensions of the CMOS structure are at the micron level. The structure of the on-chip antenna needs to directly interconnect the antenna unit and the CMOS structure. There will be an order of magnitude difference, and the structural setting between the antenna unit and the CMOS structure is difficult

Method used

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  • An on-chip antenna and antenna array
  • An on-chip antenna and antenna array
  • An on-chip antenna and antenna array

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Experimental program
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Effect test

Embodiment 1

[0022] Such as figure 1 as shown, figure 1 It is a three-dimensional structural schematic diagram of the on-chip antenna of the present invention; the on-chip antenna of the present invention includes an antenna substrate 2, a patch antenna unit 1 arranged on the upper surface of the antenna substrate 2, and a CMOS unit arranged on the lower surface of the antenna substrate 2 , the CMOS unit includes a quasi-coaxial feeding structure 5 and a coplanar waveguide feeding structure 4 , and the patch antenna unit 1 is provided with a feeding probe 3 . The feeding probes 3 can be arranged as probe metal pillars 7 that are vertically bundled and distributed.

[0023] Such as figure 2 as shown, figure 2 It is a partial cross-sectional view of the on-chip antenna of the present invention; the quasi-coaxial feeding structure 5 includes a feeding metal post 9 and a fence metal post 11 circularly distributed on the periphery of the feeding metal post 9; the feeding metal post 9 The ...

Embodiment 2

[0028] The antenna substrate 2 is set as a dielectric board with a single dielectric layer; correspondingly, the antenna substrate 2 is a double-sided copper-clad laminate. Specifically, the upper surface of the antenna substrate 2 is corroded or etched with a " The patch antenna unit 1 in the shape of "chuan" or "mountain" is etched or etched into a circular feeding channel on the lower surface of the antenna substrate 2, that is, a circular feeding channel is arranged inside the circular feeding channel. Shaped probe metal patch 8, the probe metal post 7 is connected to the upper surface of the probe metal patch 8, and the outer copper clad part of the circular feed channel is used as the antenna reflection ground 6.

[0029] The feeding probe 3 can simply be set as a probe metal post 7 at the corresponding position, and the end of the probe metal post 7 corresponds to the connection position with the patch antenna unit 1; When the positive electrode diameter of the electric...

Embodiment 3

[0031] If the working bandwidth of the antenna is very wide, the antenna substrate 2 can be set as a dielectric plate formed by stacking multiple dielectric layers. The copper-clad plate on the upper surface of the dielectric layer on the uppermost layer is corroded or etched to form the patch antenna unit 1 in the shape of the word "Chuan" or "mountain" of the required size, and the copper-clad plate on the lower surface of the dielectric layer on the lowermost layer Corrosion or etching out the circular feeding channel, and other copper-clad areas serve as antenna reflection ground 6 .

[0032] A plurality of metal post through holes vertically clustered and distributed are set in the dielectric layer, and the metal post through holes are used for installing the metal post 7 of the probe, or the metal post through hole is filled by a growth process to form the probe. At the same time, it is worth pointing out that metallizing the inner wall of the through hole of the metal c...

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PUM

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Abstract

The invention discloses an antenna on a chip and an antenna array, comprising an antenna substrate, a patch antenna unit arranged on the upper surface of the antenna substrate, and a CMOS unit arranged on the lower surface of the antenna substrate, the CMOS unit includes a quasi-coaxial feed structure and a coplanar waveguide feeding structure, the patch antenna unit is provided with a feeding probe, the quasi-coaxial feeding structure is connected to the feeding probe, and the coplanar waveguide feeding structure is connected to the Quasi-coaxial feeding structure connection; the structure of the on-chip antenna in the present invention has good engineering realization under the current processing and process conditions; and the quasi-coaxial feeding structure and coplanar waveguide feeding structure are adopted, so that The antenna has high feeding efficiency, and at the same time enables the antenna to have multi-channel feeding capability and coupling correction function.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to an on-chip antenna and an antenna array. Background technique [0002] With the development of millimeter wave technology, there are more and more millimeter wave antennas and radar applications. With the improvement of processing and preparation technology, the integration of products is higher and the volume is smaller. On-chip antennas are antennas designed on wafers, integrated circuits, and chips. They have the characteristics of high integration, compact structure, and fineness. For the CMOS (Complementary Metal Oxide Semiconductor) structure, it is a layered structure in which multiple layers of metal and oxide are alternately stacked, and is generally attached to a substrate such as silicon, germanium, and gallium arsenide. The size parameters of traditional millimeter-wave antennas are at the millimeter level, and the size and dimensions of the CMOS structure are at t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/48H01Q1/50H01Q19/10
CPCH01Q1/38H01Q1/48H01Q1/50H01Q19/104
Inventor 陈谦万应禄张小林金谋平马强戴跃飞
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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