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Cutting device

A cutting device and cutting tool technology, which are applied in the directions of grinding/polishing safety device, grinding feed motion, grinding workpiece support, etc., can solve the problems of high manufacturing cost of cutting device and complicated device structure, etc.

Active Publication Date: 2019-07-09
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, compared with the manual cutting device, the device structure is still complicated, and the manufacturing cost of the cutting device is relatively expensive.

Method used

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Examples

Experimental program
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Embodiment Construction

[0028] A cutting device according to one embodiment of the present invention will be described with reference to the drawings. First, use figure 1 The workpiece of the cutting device according to this embodiment will be described. figure 1 It is a perspective view schematically showing a workpiece and a cutting device.

[0029] The workpiece 1 is, for example, a substrate made of materials such as silicon, SiC (silicon carbide), or other semiconductors, or materials such as sapphire, glass, quartz, and ceramics. Alternatively, the to-be-processed object is a package substrate in which the device is covered with resin. Lines to be divided are set on the workpiece 1 , and device chips can be formed when the object 1 is divided by cutting along the lines to be divided.

[0030] Next, the cutting device 2 of this embodiment will be described. The cutting device 2 has a device base 4 for supporting various structures, and on the upper surface of the device base 4, there are: a ...

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PUM

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Abstract

The invention provides a cutting device which does not use an independent conveying mechanism to convey a processed object. The cutting apparatus includes: a cutting unit that cuts a workpiece with acutting tool; a machining feed unit that moves the chuck table between a machining region in which the workpiece is cut and a carrying-in / out region in which the workpiece is carried in / out; a movingunit that moves the cutting unit in an indexing feeding direction and a direction perpendicular to the holding surface; a mounting region on which the workpiece to be machined before cutting is mounted; a moving-out unit that moves out the cut workpiece; and a transport pad that transports the pre-cut workpiece to a chuck table located in the input / output region and transports the cut workpiece tothe output unit. The transfer pad is attached to and detached from the moving unit and attracts and holds the workpiece in a state where the transfer pad is attached to the moving unit, thereby attracting and holding the workpiece and moving the workpiece by the moving unit to transfer the workpiece.

Description

technical field [0001] The present invention relates to a cutting device for cutting a workpiece with a cutting tool. Background technique [0002] There is known a cutting device that cuts substrates such as semiconductor wafers, package substrates, ceramic substrates, and glass substrates with a cutting tool attached to a spindle in a device chip manufacturing process. [0003] The cutting device includes: a cutting unit having a cutting tool; and a chuck table holding a workpiece. The operator of the cutting device loads the workpiece into the cutting device and places it on the holding surface of the upper surface of the chuck table. Then, the workpiece is sucked and held on the chuck table, and the cutting blade is brought into contact with the workpiece while rotating to cut the workpiece. After the cutting is completed, the operator unloads the workpiece from the chuck table. [0004] In this manner, a cutting device in which an operator carries a workpiece to a ch...

Claims

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Application Information

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IPC IPC(8): B24B41/06B24B41/00B24B7/22B24B55/06B24B57/02B08B3/02
CPCB24B41/068B24B41/005B24B7/228B24B55/06B24B57/02B08B3/02
Inventor 福冈武臣
Owner DISCO CORP