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Cutting device

A cutting device and cutting tool technology, which are applied in the directions of grinding/polishing safety device, grinding feed motion, grinding workpiece support, etc., can solve the problems of high manufacturing cost of cutting device and complicated device structure, etc.

Active Publication Date: 2022-08-02
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, compared with the manual cutting device, the device structure is still complicated, and the manufacturing cost of the cutting device is relatively expensive.

Method used

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Examples

Experimental program
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Embodiment Construction

[0028] A cutting device according to one embodiment of the present invention will be described with reference to the drawings. First, use figure 1 A to-be-processed object of the cutting apparatus of this embodiment is demonstrated. figure 1 It is a perspective view schematically showing a workpiece and a cutting device.

[0029] The workpiece 1 is, for example, a substrate made of materials such as silicon, SiC (silicon carbide), or other semiconductors, or materials such as sapphire, glass, quartz, and ceramics. Alternatively, the workpiece is a package substrate in which the device is covered with resin. A planned dividing line is set on the workpiece 1, and when the workpiece 1 is divided by cutting along the planned dividing line, a device chip can be formed.

[0030] Next, the cutting device 2 of the present embodiment will be described. The cutting apparatus 2 has an apparatus base 4 that supports each structure, and on the upper surface of the apparatus base 4 is p...

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PUM

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Abstract

A cutting device is provided to transport the workpiece without using a separate transport mechanism. The cutting device includes a cutting unit for cutting a workpiece with a cutting tool, and a machining feed unit for placing a chuck table in a machining area where the workpiece is cut and a loading and unloading unit for loading and unloading the workpiece. Move between areas; moving unit, which moves the cutting unit in the direction of the indexing feed and in the direction perpendicular to the holding surface; placing area, which is used to place the workpiece before cutting; The workpiece is unloaded; the transfer pad transports the workpiece before cutting to the chuck table located in the loading and unloading area, and transports the workpiece after cutting to the unloading unit, and the transfer pad is attached and detached relative to the moving unit , the workpiece is sucked and held while being attached to the moving unit, and the workpiece is moved by the moving unit while being sucked and held to convey the workpiece.

Description

technical field [0001] The present invention relates to a cutting device for cutting a workpiece with a cutting tool. Background technique [0002] There are known cutting apparatuses that cut substrates such as semiconductor wafers, package substrates, ceramic substrates, and glass substrates with a cutting tool attached to a spindle in a manufacturing process of a device chip. [0003] The cutting device includes a cutting unit having a cutting tool and a chuck table that holds a workpiece. The operator of the cutting device carries the workpiece into the cutting device and places it on the holding surface of the upper surface of the chuck table. Then, the workpiece is sucked and held on the chuck table, and the cutting tool is rotated while being brought into contact with the workpiece to cut the workpiece. After the cutting is completed, the operator removes the workpiece from the chuck table. [0004] In this way, a cutting device in which a workpiece is carried into...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B41/06B24B41/00B24B7/22B24B55/06B24B57/02B08B3/02
CPCB24B41/068B24B41/005B24B7/228B24B55/06B24B57/02B08B3/02
Inventor 福冈武臣
Owner DISCO CORP