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Laser activated ink used for preparing mobile phone three-dimensional circuits, and preparation method thereof

A technology of three-dimensional circuit and laser activation, applied in printed circuit manufacturing, ink, printed circuit, etc., to achieve high efficiency, good reliability, and broad market prospects

Inactive Publication Date: 2019-07-09
戴春东
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the back cover of many mobile phones is made of metal. Because the metal back cover is strong in shielding more complex signals, and it is difficult for the metal back cover to realize the wireless charging function of the mobile phone, the short board of the metal back cover as a mobile phone body is also beginning to appear.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A laser-activated ink for making three-dimensional circuits of mobile phones is made of the following raw materials according to weight percentage: 60% of resin, 30% of solvent, and 10% of catalyst additive.

[0028] Wherein, the resin is epoxy resin; the solvent is DBE solvent; and the catalyst additive is an organometallic complex.

[0029] The above-mentioned preparation method of the laser-activated ink used for making the three-dimensional circuit of the mobile phone has the following steps: 1) Weighing each raw material according to the proportion; 2) Sending each raw material into a grinding and dispersing device, and mixing and stirring evenly to obtain the product.

[0030] In this embodiment, the method for manufacturing a three-dimensional circuit of a mobile phone based on the above-mentioned laser-activated ink has the following steps:

[0031] 1) Spray the laser-activated ink used to make the three-dimensional circuit of the mobile phone on the surface of ...

Embodiment 2

[0036] A laser-activated ink for making three-dimensional circuits of mobile phones is made of the following raw materials according to weight percentage: 65% of resin, 23% of solvent and 12% of catalyst additive.

[0037] Wherein, the resin is epoxy resin; the solvent is DBE solvent; and the catalyst additive is an organometallic complex.

[0038] The above-mentioned preparation method of the laser-activated ink used for making the three-dimensional circuit of the mobile phone has the following steps: 1) Weighing each raw material according to the proportion; 2) Sending each raw material into a grinding and dispersing device, and mixing and stirring evenly to obtain the product.

[0039] In this embodiment, the method for manufacturing a three-dimensional circuit of a mobile phone based on the above-mentioned laser-activated ink has the following steps:

[0040] 1) Spray the laser-activated ink used to make the three-dimensional circuit of the mobile phone on the surface of t...

Embodiment 3

[0045] A laser-activated ink for making three-dimensional circuits of mobile phones is made of the following raw materials according to weight percentage: 65% of resin, 25% of solvent, and 10% of catalyst additive.

[0046] Wherein, the resin is epoxy resin; the solvent is DBE solvent; and the catalyst additive is an organometallic complex.

[0047] The above-mentioned preparation method of the laser-activated ink used for making the three-dimensional circuit of the mobile phone has the following steps: 1) Weighing each raw material according to the proportion; 2) Sending each raw material into a grinding and dispersing device, and mixing and stirring evenly to obtain the product.

[0048] In this embodiment, the method for manufacturing a three-dimensional circuit of a mobile phone based on the above-mentioned laser-activated ink has the following steps:

[0049] 1) Spray the laser-activated ink used to make the three-dimensional circuit of the mobile phone on the surface of ...

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Abstract

The invention discloses a laser activated ink used for preparing mobile phone three-dimensional circuits. The laser activated ink used for preparing mobile phone three-dimensional circuits is preparedfrom, by weight, 60 to 70% of a resin, 20 to 30% of a solvent, and 8 to 12% of a catalyst additive. The invention also discloses a preparation method of the laser activated ink used for preparing mobile phone three-dimensional circuits, and a mobile phone three-dimensional circuit preparation method based on the laser activated ink. After laser irradiation of the laser activated ink, particles are released by an organic metal compound, and then circuit patterns are obtained through chemical copper plating. The laser activated ink is suitable to be used for preparing of signal receiving three-dimensional circuits prepared from glass, ceramic, and metal mobile phone shells, is capable of solving a problem in the prior art that mobile phone shell signal transmission capability is poor, and satisfying requirements of 4.5G / 5G communication time requirements, and is promising in market prospect.

Description

technical field [0001] The invention relates to an ink, in particular to a laser-activated ink for making a three-dimensional circuit of a mobile phone and a preparation method thereof. Background technique [0002] With the advent of the 4.5G / 5G communication era and the gradual maturity of wireless charging technology for mobile phones, the market has put forward higher requirements for the transmission of mobile phone signals. At present, the back cover of many mobile phones is made of metal. Because the metal back cover is strong in shielding more complex signals, and it is difficult for the metal back cover to realize the wireless charging function of the mobile phone, the short board of the metal back cover as a mobile phone body is also beginning to appear. . How to enhance the signal transmission capability of the back cover of the mobile phone has become a research hotspot in the field of communication. Contents of the invention [0003] The object of the presen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102C09D11/03C09D11/033C23C18/38C23C18/32H05K3/18
CPCC09D11/03C09D11/033C09D11/102C23C18/32C23C18/38H05K3/182H05K3/185
Inventor 戴春东
Owner 戴春东