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Stable operation pad for electronic circuit board soldering

An electronic circuit board, stable technology, applied in the field of operation pads, can solve problems such as melting, skewed connection points, and no fixing devices, etc., to achieve the effects of increasing service life, solving burrs, and improving work efficiency

Inactive Publication Date: 2019-07-09
GUILIN SHIHUAN WASTE GAS TREATMENT EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing circuit board welding generally uses tin welding, the temperature is relatively high, and there is no fixing device during welding, resulting in skewed joints, etc. The high temperature during welding cannot be lowered quickly, causing the heat to melt other places. cause the circuit board to burn

Method used

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  • Stable operation pad for electronic circuit board soldering
  • Stable operation pad for electronic circuit board soldering
  • Stable operation pad for electronic circuit board soldering

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] see Figure 1-3 , the present invention provides a technical solution: a stable operation pad for electronic circuit board welding, including a device body 1 and a mechanical arm 2, a mechanical arm 2 is arranged above the device body 1, and one end of the mechanical arm 2 is connected to the device body 1 Transmission connection, a welding head track 201 is provided above the mechanical arm 2, and the welding head track 201 is embedded on the mechanica...

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Abstract

The invention discloses a stable operation pad for electronic circuit board soldering. The stable operation pad comprises a device body and a mechanical arm, wherein the mechanical arm is arranged above the device body, one end of the mechanical arm is connected with the device body in a transmission manner, a welding head track is arranged above the mechanical arm, the welding head track is embedded in the mechanical arm, a slide track is arranged above the device body, the slide track is fixedly connected on the device body, a blower is arranged at the right of the device body, and the blower is fixedly connected on the device body. The stable operation pad for electronic circuit board soldering is provided with a thermal insulating layer that is tightly attached to the operation pad, ametal net is arranged below the thermal insulating layer, the meal net is tightly attached to the thermal insulating layer that is made of a high temperature resisting material, so that high temperature due to welding is prevented from melting the workbench, and the workbench is further protected.

Description

technical field [0001] The invention relates to the technical field of operation pads, in particular to a stable operation pad used for welding electronic circuit boards. Background technique [0002] The so-called circuit board and circuit board soldering technology have developed in the electronics industry in recent years. It can be noticed that an obvious trend is the reflow soldering technology. In principle, traditional plug-in parts can also be used in reflow soldering process, which is commonly referred to as through-hole reflow soldering. The advantage is that it is possible to complete all solder joints at the same time, keeping production costs to a minimum. However, temperature-sensitive components limit the application of reflow soldering, whether it is a plug-in or SMD. Then people turn their attention to selective soldering. Selective soldering can be used after reflow soldering in most applications. This will be an economical and efficient soldering method...

Claims

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Application Information

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IPC IPC(8): H05K3/34B23K3/08B23K101/42
CPCH05K3/34B23K3/08B23K3/087B23K2101/42
Inventor 不公告发明人
Owner GUILIN SHIHUAN WASTE GAS TREATMENT EQUIP
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