A cutting device for bonding gold wire processing

Abstract

The invention discloses a cutting device for processing of a gold bonding wire. The cutting device comprises supporting seats, gaskets, a tank body, a wire inlet, a first bearing rod, a bearing rack,a second bearing rod and a bolt. According to the cutting device, a limiting mechanism is mounted on the left side in the tank body; the position of a second roller remains unchanged under the actionof a first compression spring, and the problem that subpackaging efficiency of the gold bonding wire is relatively low as the position of the gold bonding wire is inconvenient to limit during subpackaging is solved; and a wire cutting mechanism is arranged on the right side in the tank body, when the size of the gold bonding wire in a mounting rack and a protection piece is relatively large, a transmission rod rotates on a rotating shaft to drive a connecting rod to slide in a sliding groove, a rubber block and a clamping groove at the bottom are in clearance fit to press the gold bonding wire, a cutting blade cuts the gold bonding wire, and the problems that spools of different sizes are inconvenient to mount, besides, the spools hardly automatically stop after winding, and manpower is wasted as real-time observation is required to guarantee subpackaging efficiency are solved.

Description

technical field [0001] The invention relates to the related field of bonding gold wire processing, in particular to a cutting device for bonding gold wire processing. Background technique [0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the ingot is cold processed after homogenization, or manufactured by liquid extrusion process; bonding wire is an important accessory in semiconductors, often used as inner leads for microelectronic packaging, and is an important basis for integrated circ...

AI Technical Summary

Problems solved by technology

[0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the ingot is cold processed after homogenization, or manufactured by liquid extrusion process; bonding wire is an important accessory in semiconductors, often used as inner leads for microelectronic packaging, and is an important basis for integrated circuits and semiconductor components Materials, in the actual production process, the bonding gold wire is mainly divided into JC2, JC3, JE1 and JE2 several types, they have different chemical composition, electrical properties and mechanical properties, etc.; the bonding gold wire is usually wound in the volume On the larger I-shaped wheel, then the bonding gold wire is subpackaged on the smaller I-shaped wheel by the cutting device for use. The bonding gold wire cutting device of the prior art is inconvenient for the bonding gold wire when subpackaging. The position is limited, so that the efficiency of the bonding gold wire packaging is poor; it is inconvenient to install I-shaped wheels of different sizes, and it is inconvenient to automatically stop after the I-shaped wheel is wound. In order to ensure the efficiency of packaging, it is necessary to observe in real time, resulting in manpower waste

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