Radio frequency power supply cooling device and method and semiconductor processing equipment

Abstract

The invention provides a radio frequency power supply cooling device and method and semiconductor processing equipment. The device comprises a cooling water path, a water inlet pipe, a water outlet pipe, an water inlet valve, a water outlet valve and a purging device, wherein the water inlet valve is set in the water inlet pipe and is used for turning on or off the water inlet pipe, the water outlet valve is arranged on the water outlet pipe and is used for turning on or off the water outlet pipe, the purging device is used for purging the cooling water path after the water inlet valve is closed. According to the radio frequency power supply cooling device provided by the invention, the condensation of water vapor inside a radio frequency power supply can be avoided, therefore, the life ofthe radio frequency power supply can be improved, and the cost of a machine is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a radio frequency power supply cooling device and method, and semiconductor processing equipment. Background technique [0002] The etching machine is an indispensable equipment in the integrated circuit manufacturing process. The principle of the etching machine is: the process gas is ionized under the action of the upper radio frequency system to generate active plasma and free radicals, and the plasma and free radicals are in the lower radio frequency system. Under the action of the wafer, it reaches the surface of the wafer and undergoes a series of physical and chemical reactions with the wafer to complete the processing of the wafer. [0003] When the etching machine is working, the upper and lower RF systems are generally used. The upper RF system is used to generate plasma, and the lower RF system is used to generate a bias that can attract plasma to m...

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Problems solved by technology

[0004] However, in the prior art, during the process, the cooling device used to cool the radio frequency power supply is kept on, which will cause the water vapor inside the radio frequency power supply to condense, which will cause the radio frequency power supply to Damage, especially for pulse power supplies with advanced processes, this phenomenon is more obvious, and in severe cases, it will affect the normal operation of the machine and increase the cost of the machine

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