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A method for manufacturing a cavity structure with pads at the bottom

A manufacturing method and cavity technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of uneven bottom, high process cost, unfavorable chip grounding interconnection, etc., and reduce the complexity. and cost effects

Active Publication Date: 2021-08-24
浙江集迈科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But for the structure where the RF chip is to be embedded in the silicon cavity, if the TSV is made first, the cavity needs to be made on the back of the adapter board, the bottom of the TSV is the bottom of the cavity, and then the interconnection is made, and the depth of the TSV will vary. , the bottom of the cavity will be uneven, which is not conducive to the grounding interconnection of the chip; if the cavity is made first, and then the TSV is made, the TSV etching process needs to be performed on the bottom of the cavity, and the pad must be set after the electroplating is completed, and the process cost is relatively high. high

Method used

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  • A method for manufacturing a cavity structure with pads at the bottom
  • A method for manufacturing a cavity structure with pads at the bottom
  • A method for manufacturing a cavity structure with pads at the bottom

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Embodiment Construction

[0029] Embodiments of the present invention are described in detail below, wherein the same or similar reference numerals represent the same or similar elements or elements with similar functions. The embodiments described below by referring to the figures are exemplary, and are only used to explain the present invention and not to limit the present invention.

[0030] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this invention belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with the meaning in the context of the prior art, and unless defined as herein, will not be used in an idealized or overly formal meaning to explain.

[0031] The reference numerals related to the steps mentioned in ...

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Abstract

The invention discloses a method for manufacturing a cavity structure with pads at the bottom. The specific processing includes the following steps: 101) pad preparation step, 102) adapter plate lower surface treatment step, 103) forming step; the invention provides a cavity A method for manufacturing a cavity structure with pads at the bottom, which realizes pads at the bottom.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a cavity structure with pads at the bottom. Background technique [0002] Millimeter wave radio frequency technology is developing rapidly in the semiconductor industry. It is widely used in high-speed data communication, automotive radar, airborne missile tracking system, and space spectrum detection and imaging. It is expected that the market will reach 1.1 billion US dollars in 2018 and become an emerging industry. New applications put forward new requirements for the electrical performance, compact structure and system reliability of the product. For the wireless transmitting and receiving system, it cannot be integrated into the same chip (SOC) at present, so it is necessary to integrate different chips including the radio frequency unit , filters, power amplifiers, etc. are integrated into an independent system to realize the functions of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L23/48
CPCH01L21/76898H01L23/481
Inventor 冯光建
Owner 浙江集迈科微电子有限公司