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Device and method for collecting defective products of integrated circuit chip testing braiding machine

A chip testing and integrated circuit technology, which is applied to the collection device and field of defective products of integrated circuit chip testing and braiding machines, can solve problems such as troublesome handling of defective products, and achieve the effects of simple structure, reasonable design, and neat and orderly collection

Inactive Publication Date: 2019-07-19
FUZHOU PALIDE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sorting of semiconductor devices in the existing production is to send the defective products to the waste trough through the conveying mechanism, or remove the defective products through the unloading mechanism, and the defective products are not collected uniformly, which causes inconvenience for the subsequent processing of the defective products. necessary trouble

Method used

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  • Device and method for collecting defective products of integrated circuit chip testing braiding machine
  • Device and method for collecting defective products of integrated circuit chip testing braiding machine
  • Device and method for collecting defective products of integrated circuit chip testing braiding machine

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0021] Such as Figure 1-2 As shown, a device for collecting defective products of an integrated circuit chip testing braiding machine includes a base installed on the table, and the base is sequentially equipped with a feeding guide rail and a receiving mechanism;

[0022] The receiving mechanism includes a receiving pipe, a linear slide table vertically installed on the frame, and several fixed blocks are sequentially arranged on the slide table of the linear slide table from top to bottom. There is a vertical plate on the input side, the fixed block and the vertical plate are locked on the sliding table by screws, and the channel holes are arranged on the vertical plate from top to bottom, and the channel holes correspond to the jacks on the fixed block one by one. The feeding end is inserted into the through hole and against the vertical p...

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Abstract

The invention relates to a device and method for collecting defective products of an integrated circuit chip testing braiding machine. The device comprises a mounting base, wherein a feeding guide rail and a collecting mechanism are arranged on the base; the collecting mechanism comprises collecting pipes and a vertical linear sliding table, and a plurality of fixing blocks are sequentially arranged on the sliding table from top to bottom; an inserting hole is transversely formed in each fixing block, a vertical plate is arranged on the input sides of the fixing blocks, channel holes are formed in the vertical plate from top to bottom in sequence, the channel holes are in one-to-one correspondence with the inserting holes in the fixing blocks, the feeding ends of the collecting pipes insert into the through holes to be abutted against the vertical plate, and the output ends of the feeding guide rail are in communication with the collecting pipes through the channel holes; and the feeding guide rail comprises a base block, a channel for guiding a semiconductor device is transversely arranged on the base block, a feeding port is formed in one end of the channel, blowing holes A communicating with the feeding hole are transversely formed in the feeding end of the base block, and an obliquely-arranged blowing hole B is formed in the part, above the middle of the channel, of the base block, wherein the outlet of the blowing hole B faces towards the discharging end of the base block. The collecting mechanism of the device has the advantages of being simple in structure and reasonable in design, and the defective products can be orderly collected.

Description

technical field [0001] The invention relates to a device and method for collecting defective products of an integrated circuit chip testing braiding machine. Background technique [0002] After the semiconductor device is manufactured, it needs to be inspected, marked, sorted, and taped and packaged. In the prior art, the above-mentioned work processes are carried out independently. low. For this reason, it is particularly necessary to design an all-in-one machine that integrates semiconductor device detection, marking, sorting, and taping together to improve production efficiency. The sorting of semiconductor devices in the existing production is to send the defective products to the waste trough through the conveying mechanism, or remove the defective products through the unloading mechanism, and the defective products are not collected uniformly, which causes inconvenience for the subsequent processing of the defective products. necessary trouble. Contents of the inve...

Claims

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Application Information

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IPC IPC(8): B07C5/38
CPCB07C5/38
Inventor 谢名富吴成君林康生
Owner FUZHOU PALIDE ELECTRONICS TECH
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