Novel through silicon contact structure and method of forming same
A contact and contact opening technology, used in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc.
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[0023] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not meant to be limiting. For example, forming a first feature on or over a second feature appearing in the description below may include embodiments in which the first and second features are features that are formed in direct contact, and may also include embodiments in which the first feature and the second feature are formed in direct contact. An embodiment in which an additional feature is formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. Also, the present disclosure may repeat numbers and / or letters in various examples. This repetition is for the purposes of simplicity and clarity and does no...
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