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A kind of preparation method of high emissivity ablation-resistant heat-insulating microsphere filler

A high-emissivity, microsphere filler technology, applied in ceramic products, other household utensils, household utensils, etc., can solve problems such as catastrophic damage, thermal shock failure, etc., and achieve the effect of large specific surface area

Active Publication Date: 2022-08-09
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as a ceramic material, UHTCs are a typical class of brittle materials, which are prone to thermal shock failure in extreme heating environments, resulting in catastrophic failure.

Method used

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  • A kind of preparation method of high emissivity ablation-resistant heat-insulating microsphere filler
  • A kind of preparation method of high emissivity ablation-resistant heat-insulating microsphere filler
  • A kind of preparation method of high emissivity ablation-resistant heat-insulating microsphere filler

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The present embodiment realizes the above performance through the following technical solutions:

[0032] (1) Preparation and mixing of powder: Using isopropanol or ethanol as the grinding medium, the UHTC component, the high emissivity self-healing component and the sintering aid are prepared by mass ratio of 50:50:5 by high-energy ball milling. Ball milling and mixing, the ball milling time is 36h, and the ball milling rate is 2000r / min. After the ball milling is completed, the obtained slurry is dried for 24h to a constant weight, and the mixed powder is obtained by grinding and sieving. The primary particle size of the powder after ball milling should not be greater than 200nm. ;

[0033] (2) Preparation of precursor slurry: the powder obtained in step (1) is placed in an organic solvent with a mass ratio of 3:9, fully stirred and dispersed, and then placed in an ultrasonic pulverizer for ultrasonic dispersion for 30 minutes to eliminate nano-powder The physical ag...

Embodiment 2

[0050] The present invention realizes above-mentioned performance through following technical scheme:

[0051](1) Preparation and mixing of powder: Using isopropanol or ethanol as the grinding medium, the UHTCs component, the high emissivity self-healing component and the sintering aid were prepared by high-energy ball milling in a mass ratio of 20:80:10. Ball milling and mixing, the ball milling time is 24h, and the ball milling rate is 1000r / min. After the ball milling is completed, the obtained slurry is dried for 24h to a constant weight, and the mixed powder is obtained by grinding and sieving. The primary particle size of the powder after ball milling should not be greater than 200nm. ;

[0052] (2) Preparation of precursor slurry: the powder obtained in step (1) is placed in an organic solvent with a mass ratio of 1:7, fully stirred and dispersed, and then placed in an ultrasonic pulverizer for ultrasonic dispersion for 10 minutes to eliminate nano-powder The physical ...

Embodiment 3

[0066] The present invention realizes above-mentioned performance through following technical scheme:

[0067] (1) Preparation and mixing of powder: Using isopropanol or ethanol as the grinding medium, the UHTCs component, the high emissivity self-healing component and the sintering aid were prepared by high-energy ball milling in a mass ratio of 80:80:7 Ball milling and mixing, the ball milling time is 48h, and the ball milling rate is 4000r / min. After the ball milling is completed, the obtained slurry is dried for 24h to constant weight, and the mixed powder is obtained by grinding and sieving. The primary particle size of the powder after ball milling should not be greater than 200nm. ;

[0068] (2) Preparation of precursor slurry: the powder obtained in step (1) is placed in an organic solvent with a mass ratio of 6:7, fully stirred and dispersed, and then placed in an ultrasonic pulverizer for ultrasonic dispersion for 60 minutes to eliminate nano-powder The physical agg...

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Abstract

The invention relates to a preparation method of a high-emissivity ablation-resistant and heat-insulating microsphere filler, which includes the steps of powder preparation and mixing, precursor slurry preparation, precursor powder preparation, and sintering process. Ablation of insulating microsphere fillers. Compared with the prior art, the present invention has high production efficiency, short production period, simple equipment and simple operation, and the prepared spray powder has good sphericity and special pore structure, and the coating prepared by using the microspheres as filler has the advantages of Low mass ablation rate, high self-radiation rate, good mechanical properties, can effectively resist 800kW / m 2 And the heat flow impact above, protect the matrix from high temperature erosion and deformation and failure.

Description

technical field [0001] The invention relates to the field of thermal insulation, in particular to a preparation method of a high emissivity ablation-resistant thermal insulation microsphere filler. Background technique [0002] Thermal protection systems and thermal protection materials are the cornerstones for the development and protection of hypersonic vehicles and reusable vehicles for safe service in extreme environments. In order to improve the survivability of aircraft and break through the "new thermal barrier" problem of thermal protection, efficient thermal protection systems and thermal protection materials must improve their ability to withstand extreme service environments and meet the temperature resistance, durability and reliability requirements of aircraft thermal protection systems . Among the existing thermal protection systems, the most mature and best thermal insulation system is the ablative thermal insulation system. Ablation heat protection means th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B38/00C04B35/56C04B35/58C04B35/584C04B35/622
CPCC04B38/009C04B35/58078C04B35/5805C04B35/58092C04B35/5622C04B35/584C04B35/622C04B2235/3839C04B2235/3813C04B2235/3886C04B2235/3826C04B2235/38C04B2235/428C04B2235/408C04B2235/3804C04B2235/3873C04B2235/3895C04B2235/3281
Inventor 张瑞吉孙序成郭芳威赵晓峰
Owner SHANGHAI JIAOTONG UNIV
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