Preparation method of seed layer

A seed layer and seed technology, applied in the input/output process of data processing, instruments, electrical digital data processing, etc., can solve the problems of complex process steps, high production cost, silver paste residue, etc., and achieve simplified process flow, grinding Fast speed, avoid the effect of being oxidized

Active Publication Date: 2019-07-23
SUZHOU LANPEI OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of preparation method of seed layer, be used for solving the upper surface of flexible material layer in the prior art and will cause on the flexible material layer when scraping coating. There are silver paste residu

Method used

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  • Preparation method of seed layer
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  • Preparation method of seed layer

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Embodiment Construction

[0064] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0065] see Figure 2 to Figure 8 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...

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Abstract

The invention provides a preparation method of a seed layer. The preparation method comprises the following steps: providing a printing working platform; arranging a soft liner on the upper surface ofthe printing working platform, wherein a flexible laminated structure is arranged on the upper surface of the soft liner and comprises a flexible substrate and a flexible material layer, the flexiblesubstrate is located on the upper surface of the soft liner, the flexible material layer is located on the upper surface of the flexible substrate, and a plurality of groove structures are formed inthe upper surface of the flexible material layer; preparing seed ink; placing seed ink on the upper surface of the flexible material layer; and performing blade coating on the seed ink by using a blade coating tool so as to form a seed layer in each groove structure. According to the preparation method of the seed layer, the cleanliness of the upper surface of the flexible material layer can be ensured after blade coating is completed, and extra pre-curing and cleaning steps are not needed, so that the technological process is simplified, and the production cost is reduced; the seed ink provided by the invention can ensure that the iron powder has high reducibility.

Description

technical field [0001] The invention belongs to the field of touch technology, in particular to a method for preparing a seed layer. Background technique [0002] The metal grid contained in the touch screen (also known as the touch screen) is provided with a plurality of corresponding groove structures on the surface of the flexible material layer, and micro-nano metal wire structures are formed in the groove structures. In the existing technology, such as figure 1 As shown, generally, the flexible laminated structure 10 including the flexible substrate 101 and the flexible material layer 102 is placed on the upper surface of a printing work platform 12, and then the silver paste 13 is drip-coated on the upper surface of the flexible material layer 102, and finally The silver paste 13 is scraped with a doctor blade 14 so that the silver paste 13 is filled in each of the groove structures 11 to form a conductive layer. [0003] When adopting the above-mentioned process met...

Claims

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Application Information

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IPC IPC(8): G06F3/041C09D11/03C09D11/52
CPCC09D11/03C09D11/52G06F3/041G06F2203/04103
Inventor 陈春明郭向阳谢自民平财明王庆军
Owner SUZHOU LANPEI OPTOELECTRONICS TECH CO LTD
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