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Wafer inspection device

一种检查装置、晶片的技术，应用在测量装置、电子电路测试、仪器等方向

Pending Publication Date: 2019-07-26
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main board of each test head needs to be replaced periodically because it is a consumable

Method used

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  • Wafer inspection device
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Examples

Experimental program
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Embodiment Construction

[0038] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0039] First, the maintenance trolley of the wafer inspection apparatus according to the present embodiment will be described.

[0040] figure 1 It is a perspective view schematically showing the configuration of a wafer inspection device to which the maintenance cart of this embodiment is applied.

[0041] exist figure 1 Among them, the wafer inspection apparatus 10 includes: a plurality of inspection chambers (chambers) 11 arranged in multiple layers, for example, a chamber station 12 of 4 layers; shown), wafers are carried into and out of the respective chambers 11. Each of the chamber station 12 and the loading unit 13 has a rectangular parallelepiped shape and has a height of, for example, 2.4 m.

[0042] In the wafer inspection apparatus 10, a space for an operator to perform maintenance work on each chamber 11 is ensured on the opposite side (hereinafter re...

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PUM

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Abstract

The invention provides a wafer inspection device capable of easily pulling out a test head to be maintain. The wafer inspection device (10) includes a chamber station (12) in which a plurality of inspection chambers (11) arranged between a loading portion (13) and a space in which maintenance work for each inspection chamber (11) can be arranged in parallel, and a guide rail (41) disposed below the space side of the room station (12), and the maintenance trolley (27) used when the test head (15) is taken out from each of the inspection chambers (11) along the guide rail ( 41) Move.

Description

[0001] This case is filed on October 28, 2014 , the application number is 201410589928.8 , a divisional application with the title of invention "Trolley for maintenance of wafer inspection device and maintenance method of wafer inspection device" technical field [0002] The present invention relates to a wafer inspection apparatus having a plurality of test heads. Background technique [0003] In order to inspect the electrical characteristics of each semiconductor device on a semiconductor wafer (hereinafter simply referred to as "wafer") on which a plurality of semiconductor devices are formed, a probe device is used as a wafer inspection device. The probe device has a probe card facing a wafer, and the probe card has a plurality of contact probes as columnar contact terminals (for example, refer to Patent Document 1). In this probe device, an inspection signal is sent to a semiconductor device in which each contact probe of a probe card is connected to each electrode p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R31/28
CPCG01R1/0491H01L21/67706H01L21/67724H01L21/67769H01L21/68742G01R31/2893G01R31/2886
Inventor 萩原顺一小松茂和古屋邦浩保坂忠良村松直树
Owner TOKYO ELECTRON LTD