Dual-side cooling heat sink

A double-sided cooling and radiator technology, which is applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve the problem of affecting the normal operation of high-power components, potential safety hazards of new energy vehicles, and damage to high-power components and other problems, to achieve the effect of overcoming high welding defect rate, simple structure, and protecting heating devices

Pending Publication Date: 2019-07-26
东莞市迈泰热传科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the power module (IGBT) generates heat during the working process, if the heat generated cannot be dissipated in time, it will directly affect the normal operation of high-power components in the power module (IGBT), and may even cause high-power components Damage to new energy vehicles poses a serious safety hazard
Existing heat dissipation for the power module uses a single-layer heat dissipation plate for heat dissipation, so the heat dissipation area is small and the heat dissipation efficiency is low
In the case of multi-layer heat dissipation, welding is used to connect, and then the welding failure rate is high, and leakage problems are prone to occur

Method used

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Embodiment Construction

[0018] The preferred embodiments provided by the present invention will be specifically described according to the accompanying drawings.

[0019] Figure 1 to Figure 6 , is a preferred embodiment of a double-sided cooling radiator provided by the present invention. Such as Figure 1 to Figure 6 As shown, the double-sided cooling radiator includes a set of water inlet blocks 10, a set of water outlet blocks 20, and a cooling plate body group 30 that is sealed and docked with the water inlet block group and the water outlet block group. The block group 10 includes at least two stacked water inlet blocks 11, two adjacent water inlet blocks 11 are connected as a whole through a water inlet pipe 12, each water inlet block 11 has a water inlet cavity 111, and is in the A water inlet 112 is provided on the top water inlet block; the water outlet block group 20 includes at least two stacked water outlet blocks 21, and two adjacent water outlet blocks 21 are connected as a whole thr...

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Abstract

The invention provides a dual-side cooling heat sink. The dual-side cooling heat sink comprises a group of water inlet plug block, a group of water outlet plug block and a cooling plate body group, wherein the cooling plate body group is used for hermetically connecting the water inlet plug block group and the water outlet plug block group, the water inlet plug block group comprises at least two water inlet plug blocks which are arranged in a lamination way, two adjacent water inlet plug blocks are connected to form a whole by a water inlet pipeline, a water inlet inner cavity is formed in each water inlet plug block, a water inlet is formed in the water inlet plug block at a top layer, the water outlet plug block group comprises at least two water outlet plug blocks, and the at least twowater outlet plug blocks are arranged in a lamination way. Compared with the prior art, the dual-side cooling heat sink has the advantages a heating device is placed between two parallel cooling platebodies, cooling passages are arranged in both of an upper surface and a lower surface of each heating device, so that dual-side cooling is performed on the heating device, the assembly space is saved, the contact area is expanded, and the heat exchange efficiency is improved; and meanwhile, a spring is arranged between the two cooling plate bodies to achieve a shockproof effect, the heating device can be prevented from being extruded when external pressure is applied onto the dual-side cooling heat sink, and the heating device is protected.

Description

technical field [0001] The invention relates to the field of water cooling and heat dissipation, in particular to a double-sided cooling radiator. Background technique [0002] With the rapid development of new energy vehicles, the power of the motor controller power module (IGBT) is getting larger and smaller. Since the power module (IGBT) generates heat during the working process, if the heat generated cannot be dissipated in time, it will directly affect the normal operation of high-power components in the power module (IGBT), and may even cause high-power components Damage to new energy vehicles poses a serious safety hazard. Existing heat dissipation for the power module adopts a single-layer heat dissipation plate for heat dissipation, so that the heat dissipation area is small and the heat dissipation efficiency is low. In the case of multi-layer heat dissipation, welding is used to connect, and then the welding failure rate is high, and leakage problems are prone t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 王相彬严强
Owner 东莞市迈泰热传科技有限公司
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