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Antenna substrate and manufacturing method therefor

A technology of an antenna substrate and a manufacturing method, which is applied in directions such as antennas, antenna arrays, and antenna parts, etc., can solve the problems of inability to transmit and receive stable electromagnetic waves and poor position accuracy.

Active Publication Date: 2019-07-26
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the position accuracy of the first and second antenna conductors is poor, it may not be possible to perform stable transmission and reception of electromagnetic waves.

Method used

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  • Antenna substrate and manufacturing method therefor
  • Antenna substrate and manufacturing method therefor
  • Antenna substrate and manufacturing method therefor

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Experimental program
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Effect test

Embodiment Construction

[0015] The antenna substrate transmits and receives electromagnetic waves between the first and second antenna conductors. Therefore, if the positional accuracy of the first and second antenna conductors is poor, it may not be possible to perform stable transmission and reception of electromagnetic waves.

[0016] The antenna substrate of the present disclosure includes: a cover substrate having a first antenna conductor; a frame substrate having a plurality of openings; and a base substrate having a second antenna conductor. The lid substrate, the base substrate, and the frame substrate are firmly bonded to each other by the second bonding material having high adhesive strength while performing position correction by bonding via the first bonding material having relatively low adhesive strength. Therefore, since the positional accuracy of the first and second antenna conductors is good, stable transmission and reception of electromagnetic waves can be performed.

[0017] Nex...

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Abstract

An antenna substrate is provided with: a cap substrate (10) having first antenna conductors (12) located on both the upper and lower surfaces of a first insulation layer (11); a frame substrate (20) having an opening portion (22) which is located in a second insulation layer (21) and which, from a top view, surrounds the outer peripheries of the first antenna conductors (12) separately or surrounds the outer peripheries of two or more of the first antenna conductors (12) collectively; and a base substrate (30) having a second antenna conductor (32) located on the upper surface of a third insulation layer (31); a first adhesion material (14) that adheres the first insulation layer (11) to the second insulation layer (21); and a second adhesion material (23) that adheres the second insulation layer (21) to the third insulation layer (31), wherein the first adhesion material (14) and the second adhesion material (23) each include a first bonding material (15) and a second bonding material(16) having adhesion strength to the second insulation layer (21) higher than that of the first bonding material (15).

Description

technical field [0001] The present disclosure relates to antenna substrates and methods of manufacturing the same. Background technique [0002] In recent years, development of antenna substrates for transmitting and receiving electromagnetic waves for signals has been progressing. Antenna boards are used in wireless communication between electronic devices, in vehicle-mounted obstacle detection devices, and the like. The antenna substrate includes a spacer and two mounting substrates. For example, Patent Document 1 describes a technique for producing an antenna substrate by bonding mounting substrates to each other above and below a spacer via solder or the like. However, the antenna substrate transmits and receives electromagnetic waves between the first and second antenna conductors. Therefore, if the positional accuracy of the first and second antenna conductors is poor, it may not be possible to perform stable transmission and reception of electromagnetic waves. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01P11/00H01Q21/06H05K1/14
CPCH01Q1/38H01Q21/065H01Q9/0414H01Q9/0457C09J179/08B32B7/12B32B3/266B32B2255/02B32B2307/206B32B5/26B32B2260/023B32B5/02B32B2457/00B32B2260/046B32B2262/101B32B2255/205B32B2250/03H01P11/00H01Q21/06H05K1/14H01Q1/2283
Inventor 樱井敬三
Owner KYOCERA CORP