Printed wiring board, air conditioner, and method for manufacturing printed wiring board
A technology for printed wiring substrates, manufacturing methods, applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., capable of solving the problems of difficult wiring patterns, complex design and assembly, no mention of efficient and cheap mounting of metal chips, etc.
Active Publication Date: 2022-03-01
MITSUBISHI ELECTRIC CORP
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Problems solved by technology
[0007] However, according to the above-mentioned Patent Document 1, there are problems in that in order to reduce the temperature rise of the wiring pattern, complicated design and assembly operations are required, and it is difficult to realize heat dissipation of the wiring pattern stably, efficiently, and inexpensively.
In addition, in the above-mentioned Patent Document 2, there is no mention of a method for efficiently and inexpensively mounting metal chips.
Method used
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[0024] First, the structure of the printed wiring board 1 of the present embodiment will be described. figure 1 It is a schematic plan view showing a schematic arrangement structure of the printed wiring board 1 according to the embodiment of the present invention viewed from the second principal surface side. exist figure 1 The description of the wiring pattern 13 is omitted in . figure 2 It is an enlarged plan view of a main part of a region where the first heat dissipation surface mount component 15a is mounted on the first principal surface side of the printed wiring board 1 according to the embodiment of the present invention. image 3 It is a cross-sectional view of main parts of the region where the first heat dissipation surface mount component 15a is mounted on the printed wiring board 1 according to the embodiment of the present invention, and is figure 2 Sectional view of line III-III. exist image 3 Among them, the upper side is the first main surface side of...
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The present invention relates to a printed wiring board, an air conditioner, and a method for manufacturing a printed wiring board. In order to realize heat dissipation of a wiring pattern (13) inexpensively with a simple structure, the printed wiring board includes: an insulating substrate having a plurality of wirings on a main surface a pattern; and an electronic component mounted on the main surface and connected to the wiring pattern. In addition, the printed wiring board is characterized by including a heat dissipation surface mount component as a surface mount component that is bonded to the wiring pattern via solder on the main surface and that dissipates heat from the wiring pattern.
Description
technical field [0001] The present invention relates to a printed wiring board on which a surface mount component for heat dissipation is mounted, an air conditioner using the printed wiring board, and a method of manufacturing the printed wiring board. Background technique [0002] In a printed wiring board, when a current flows through a wiring pattern arranged on an insulating substrate, the wiring pattern generates heat. In addition, when an electric current flows through the electronic components mounted on the printed wiring board, the heat generated by the electronic components is transferred to the wiring pattern. Therefore, excessive heating of the wiring pattern may cause damage or hinder cooling of other electronic components mounted on the wiring pattern. [0003] In order to reduce heating of wiring patterns, Patent Document 1 discloses a printed wiring board in which a heat dissipation member is three-dimensionally mounted directly under a heat generating memb...
Claims
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IPC IPC(8): H05K1/02
CPCH05K1/0209H05K1/0265H05K3/305H05K2201/066H05K1/021H05K3/321H05K3/3421H05K3/3494H05K2201/10984
Inventor 三浦刚小山雅弘
Owner MITSUBISHI ELECTRIC CORP