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Heat transfer module

A technology of heat transfer and heat pipe, which is applied in the direction of instruments, electrical digital data processing, and digital data processing components, etc., can solve the problems of electronic device thermal shutdown and electronic device heat accumulation, which are difficult to deal with, and achieve the effect of reducing the occupied space

Active Publication Date: 2019-08-02
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as the size of electronic devices becomes smaller and the arrangement of electronic components becomes denser, the problem of heat accumulation in electronic devices becomes more and more difficult to deal with, which often causes thermal shutdown of electronic devices

Method used

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Embodiment Construction

[0045] figure 1 It is a schematic top view of a heat transfer module according to an embodiment of the present invention. figure 2 for figure 1 Schematic cross-sectional view of the heat transfer module along line A-A. image 3 for figure 1 Schematic cross-sectional view of the thermal transfer module along line B-B. Figure 4 for figure 1 The schematic cross-sectional view of the thermal transfer module along line C-C. Please refer to Figure 1 to Figure 4 , in this embodiment, the heat transfer module 100 is suitable for contacting the heating element 50, and transfers the heat emitted by the heating element 50 to cooling elements such as fans or cooling fins or the outside world by way of heat conduction, so as to achieve the effect of heat dissipation . The heating element 50 is, for example, a central processing unit, a processing chip, or other electronic components that generate heat in a portable electronic device (such as a smart phone, etc.). The heat transf...

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Abstract

The invention discloses a heat transfer module which is suitable for contacting a heating element. The heat transfer module includes a first plate, a second plate, and a working fluid. The second plate is connected to the first plate to form a cavity together, and the cavity extends in the extending direction of a reference plane. The working fluid is located in the cavity, the cavity is a first area, and the part, extending out of the cavity, of the first plate or the second plate is a second area. The first region transfers heat in a heat convection manner, and the second region transfers heat in a heat conduction manner. Therefore, the heat dissipation effect of the electronic device can be improved and the occupied space can be reduced.

Description

technical field [0001] The invention relates to a heat transfer device, and in particular to a heat transfer module. Background technique [0002] In recent years, with the development of the technology industry, information products such as notebook computers, tablet computers, and mobile phones have been widely used in daily life. The types and functions of electronic devices are becoming more and more diverse, and the convenience and practicality make these electronic devices more popular. [0003] The electronic device is equipped with a central processing unit (CPU), a processing chip or other electronic components, and these electronic components generate heat during operation. However, as the size of electronic devices becomes smaller and the arrangement of electronic components becomes denser, the problem of heat accumulation in the electronic devices becomes more and more difficult to deal with, which often leads to thermal shutdown of the electronic devices. Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/203G06F2200/201
Inventor 萧雅羚
Owner HTC CORP
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