Semiconductor elongated strip and method for processing same

Abstract

The method for processing a semiconductor elongated strip comprises the steps of: providing a semiconductor elongated strip; plating a predetermined surface of the semiconductor elongated strip with aprotective film; covering the protective film with a photosensitive film; covering the predetermined surface with a trench-shaped shielding cover for exposure and ion etching; and removing the photosensitive film. The method can reduce the bending and the deformation of the elongated strip during a cutting process, thereby ultimately improving the performance of a semiconductor product.

Description

technical field [0001] The invention relates to a semiconductor processing method, in particular to a semiconductor strip and a processing method thereof. Background technique [0002] Semiconductor strips are the transitional part between the wafer and the semiconductor in the semiconductor processing industry. First the wafer will be cut into multiple strips, and then the strips will be cut into multiple independent semiconductor units. In the actual processing procedure, the semiconductor strip is often bent due to the influence of its own stress, and this bending usually affects the formation of the normal final semiconductor product, thereby affecting the performance of the semiconductor. [0003] Therefore, it is urgent to provide an improved method for processing semiconductor strips to overcome the above defects. Contents of the invention [0004] An object of the present invention is to provide a method for processing semiconductor strips, which can reduce the b...

AI Technical Summary

Problems solved by technology

In actual processing procedures, semiconductor strips are often bent due to the influence of their own stress, and this bending condition usually affects the formation of normal semiconductor final products, thereby affecting the performance of semiconductors