Fan electronic component transfer mechanism
A technology of electronic components and transfer mechanism, which is applied in the direction of electrical components, printed circuits connected with non-printed electrical components, and electrical connection of printed components, etc., can solve the problems of high cost of fan materials and insignificant reduction effect of fan height, etc. Achieve the effect of reducing material cost, avoiding selection, and reducing fan height
Pending Publication Date: 2019-08-06
苏州顺福利智能科技有限公司
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Problems solved by technology
This leads to higher and higher fan material costs, and has no obvious effect on reducing the fan height. After the fan height reaches the limit, it is difficult to reduce the height.
Method used
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Embodiment
[0013] Embodiment: A fan electronic component transfer mechanism, including a circuit board 1, an electronic component 2 and an adapter plate 3, an opening structure 4 is formed on the circuit board 1, and the electronic component 2 is fixedly installed on the adapter plate 3, The adapter plate 3 is fixedly installed on the surface of the circuit board 1, the electronic components 2 on the adapter plate 3 are just inserted into the opening structure 4 of the circuit board 1, and the adapter plate 3 is formed with the electronic components 2 and the circuit board 1. A line 5 electrically connected.
[0014] In this structure, the adapter plate 3 is installed on the upper or lower surface of the circuit board 1, and the electronic components 2 on the adapter plate 3 are hidden in the opening structure 4 of the circuit board 1, which prevents the electronic components 2 from protruding from the circuit board. On the surface of board 1, the original stacked structure in the height...
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The invention discloses a fan electronic component transfer mechanism, which comprises a circuit board, an electronic component and a transfer board. A hole structure is formed on the circuit board. The electronic component is fixedly installed on the transfer board. The transfer board is fixedly installed on the surface of the circuit board. The electronic component on the transfer board is justinserted into the hole structure of the circuit board. A line electrically connecting the electronic component with the circuit board is formed on the transfer board. According to the invention, holesare formed in the circuit board and in a fan frame bottom board, the transfer board is electrically connected with the circuit board, and the electronic component is installed on the transfer board,so that electrical transfer connection between the electronic component and the circuit board is realized. Meanwhile, the electronic component is accommodated in the holes in the circuit board and inthe fan frame base, so that the electronic component, the circuit board and the fan frame bottom plate can be concealed in the same layer, the structures originally stacked in the height direction aretransformed into structures at the same height, the height of the fan is greatly reduced, the selection and use of new materials is avoided, and the material cost of the fan is reduced.
Description
technical field [0001] The invention relates to a fan, in particular to a fan electronic component switching mechanism. Background technique [0002] Cooling fans are getting thinner and thinner. In order to reduce the height of fans, everyone is working hard on controlling the thickness of materials and selecting new materials. This leads to higher and higher fan material costs, and the effect on reducing the height of the fan is not obvious. After the height of the fan reaches the limit of the material thickness, it is difficult to reduce the height. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a fan electronic component transfer mechanism, which can effectively reduce the height of the fan, and the fan material cost is low. [0004] The technical solution adopted by the present invention to solve the technical problem is: a fan electronic component transfer mechanism, including a circuit board, elec...
Claims
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IPC IPC(8): H05K1/18H05K1/11F04D25/08F04D29/52
CPCH05K1/183H05K1/11F04D25/08F04D29/522
Inventor 王金莲
Owner 苏州顺福利智能科技有限公司