Polyformaldehyde composite low in formaldehyde emission and preparation method thereof

A technology of low formaldehyde release and composite material, applied in the field of low formaldehyde release polyoxymethylene composite material and its preparation, can solve the problems of poor thermal stability, limit the use range of materials, affect molding appearance, color and performance, etc. Stability, effect of reducing odor levels and formaldehyde emissions, good color stability

Active Publication Date: 2019-08-09
KINGFA SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, POM material has poor thermal stability and is easy to decompose during processing to produce harmful formaldehyde gas, and the decomposition of POM is a continuous chain decomposition. Once the

Method used

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  • Polyformaldehyde composite low in formaldehyde emission and preparation method thereof
  • Polyformaldehyde composite low in formaldehyde emission and preparation method thereof
  • Polyformaldehyde composite low in formaldehyde emission and preparation method thereof

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preparation example Construction

[0034] The preparation method of polyoxymethylene composite material in the embodiment of the application is as follows:

[0035] Mix POM resin, primary antioxidant, secondary antioxidant, diisooctyl sebacate, allantoin, EBS and additives in a high-speed mixer for 1-2 minutes to obtain a premix, which is double- A screw extruder melts and extrudes at 150-220° C., cools, and pelletizes to obtain a polyoxymethylene composite material. Wherein, the temperature of each screw barrel of the twin-screw extruder from the feeding port to the machine head is respectively: 150°C-180°C, 170°C-220°C, 170°C-220°C, 170°C-210°C, 170°C- 210°C, 170°C-200°C, 170°C-200°C, 170°C-200°C, 170°C-200°C, 170°C-210°C, the screw speed is 250-350 rpm, and the feeding amount is 50-200kg / h, the degree of vacuum is (-0.1) ~ 0MPa.

[0036] This application sets embodiment 1~8 and comparative example 1~8, and the specific selection of POM resin, antioxidant in embodiment 1~8 is as shown in table 1, and the s...

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Abstract

The invention discloses a polyformaldehyde composite low in formaldehyde emission. The polyformaldehyde composite is prepared from, by weight, 100 parts of POM resin, 0.1-0.5 part of a main antioxidant, 0.05-0.3 part of an auxiliary antioxidant, 0.5-1.2 parts of diiso-octyl sebacate, 0.2-0.8 part of N,N'-ethyl distearamide and 0.05-0.3 part of allantoin. According to the polyformaldehyde composite, N,N'-ethyl distearamide (EBS), the main antioxidant, the auxiliary antioxidant, the allantoin and the diiso-octyl sebacate are selected as a stable processing system of POM, and the polyformaldehydecomposite low in smell grade, low in formaldehyde emission and good in color stability is prepared. Meanwhile, the invention discloses a preparation method of the polyformaldehyde composite.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polyoxymethylene composite material with low formaldehyde emission and a preparation method thereof. Background technique [0002] As a highly crystalline engineering plastic, polyoxymethylene resin (POM) has excellent self-lubricating properties, fatigue resistance and balanced mechanical properties, and is widely used in industrial machinery, automobiles, home appliances, electrical and electronic fields. However, POM material has poor thermal stability, and it is easy to decompose during processing to produce harmful formaldehyde gas, and the decomposition of POM is a continuous chain decomposition. Once the decomposition occurs, it is difficult to be suppressed, which will affect the appearance, color and performance of the molding. This defect of POM material greatly limits the scope of use of the material. [0003] The decomposition mechanism of POM materials is that the...

Claims

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Application Information

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IPC IPC(8): C08L59/00C08K5/00C08K5/3445C08K5/11C08K5/20
CPCC08K5/00C08K5/005C08K5/11C08K5/20C08K5/3445C08L2201/08C08L59/00
Inventor 付学俊叶南飚黄险波陈锋丁超彭忠泉
Owner KINGFA SCI & TECH CO LTD
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