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A magnetic target of a magnetron sputtering circular plane target gun that improves the utilization rate of the target material

A technology of magnetron sputtering and planar target, which is applied in the field of magnetron sputtering and can solve the problems of unsuitable magnetic target

Active Publication Date: 2020-07-14
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the magnetic target provided by this invention is not suitable for the magnetic target of circular planar magnetron target gun

Method used

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  • A magnetic target of a magnetron sputtering circular plane target gun that improves the utilization rate of the target material
  • A magnetic target of a magnetron sputtering circular plane target gun that improves the utilization rate of the target material
  • A magnetic target of a magnetron sputtering circular plane target gun that improves the utilization rate of the target material

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Embodiment Construction

[0031] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0032] The present invention provides a magnetic target of a circular planar magnetron target gun that improves the utilization rate of the target, the magnetic target includes a target 1 and a magnet; the magnet includes a cylindrical magnet 4 and a quincunx-shaped ring magnet 3; The cylindrical magnet 4 is located at the center of the quincunx-shaped ring magnet 3; the cylindrical magnet 4 is concentric with the quincunx-shaped ring magnet 3 and has the same magnet height.

[0033] Such as Figure 2 ...

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Abstract

The invention provides a magnetic target of a magnetron sputtering circular planar target gun for improving target utilization rate. The magnetic target comprises a target body and magnets; the magnets comprise a cylindrical magnet and a quincunx annular magnet; the cylindrical magnet is positioned in the center of the quincunx annular magnet; the cylindrical magnet and the quincunx annular magnetare concentric and have the same height. Compared with the magnetic target of a traditional magnetron sputtering circular planar target gun, the magnetic target can increase the width of a target etching groove in a magnetron sputtering process, thereby improving the target utilization rate.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering, in particular to a magnetic target for a magnetron sputtering circular planar target gun which improves the utilization rate of the target. Background technique [0002] Magnetron sputtering is a kind of physical vapor deposition. It adopts the interaction mode of magnetic field and electric field, and constrains electrons to run in a spiral near the target surface, thereby increasing the probability of electrons hitting neutral atoms to generate ions. The increased ion density reduces the Crooke dark area, increases the ion bombardment rate of the target, and thus increases the sputtering rate. The ions generated by the electron collision hit the target surface under the action of the electric field, remove the material from the target material, and the emitted material atoms or atomic clusters diffuse to the substrate surface and are collected on the surface to form a thin film. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35
CPCC23C14/3407C23C14/35
Inventor 付学成
Owner SHANGHAI JIAOTONG UNIV