Display substrate and manufacturing method thereof

A technology for display substrates and substrates, used in semiconductor/solid-state device manufacturing, instruments, electrical components, etc.

Active Publication Date: 2019-08-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a display substrate and its preparation method, so as to solve the problem that the existing display substrate can only realize the key-type fingerprint recognition in the non-display area by means of external bonding.

Method used

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  • Display substrate and manufacturing method thereof
  • Display substrate and manufacturing method thereof
  • Display substrate and manufacturing method thereof

Examples

Experimental program
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Effect test

no. 1 example

[0069] The display substrate of this embodiment is prepared by a complementary metal-oxide-semiconductor (Complementary MetalOxide Semiconductor, CMOS) process. Such as figure 2 As shown, the embodiment of the present invention shows that the display substrate includes a base 10, and a light emitting structure layer 11 and a fingerprint recognition structure layer 12 formed on the base 10. The light emitting structure layer 11 includes a light emitting unit 13 and a light emitting driving circuit 14. The light emitting unit 13 is used for The display light is emitted, and the light-emitting drive circuit 14 is used to control and drive the light-emitting unit 13 . The fingerprint identification structure layer 12 includes a fingerprint identification sensor 15 and a processing circuit 16. The fingerprint identification sensor 15 is used to form a fingerprint electrical signal, and the processing circuit 16 is used to receive the fingerprint electrical signal from the fingerpr...

no. 2 example

[0095] Figure 13 A schematic diagram showing the structure of the second embodiment of the substrate according to the present invention shows a structure prepared by using an N-channel metal-oxide-semiconductor (Negative Channel Metal Oxide Semiconductor, NMOS) process.

[0096] Such as Figure 13 As shown, the display substrate of this embodiment includes a base 10 , and a light emitting structure layer 11 and a fingerprint recognition structure layer 12 formed on the base 10 . The light-emitting structure layer 11 includes a light-emitting unit and a light-emitting drive circuit. The fingerprint recognition structure layer 12 includes a fingerprint recognition sensor for forming fingerprint electrical signals. The fingerprint recognition sensor includes a piezoelectric film layer, and the piezoelectric film layer is located between the light-emitting unit and the light-emitting drive circuit. and cover the pixel unit, the light emitting unit penetrates through the piezoele...

no. 3 example

[0100] Figure 14 A schematic diagram showing the structure of the third embodiment of the substrate according to the present invention shows a structure prepared by using a P-channel metal-oxide-semiconductor (Positive Channel Metal Oxide Semiconductor, PMOS) process.

[0101] Such as Figure 14 As shown, the display substrate of this embodiment includes a base 10 , and a light emitting structure layer 11 and a fingerprint recognition structure layer 12 on the base 10 . The light-emitting structure layer 11 includes a light-emitting unit and a light-emitting drive circuit. The fingerprint recognition structure layer 12 includes a fingerprint recognition sensor for forming fingerprint electrical signals. The fingerprint recognition sensor includes a piezoelectric film layer, and the piezoelectric film layer is located between the light-emitting unit and the light-emitting drive circuit. and cover the pixel unit, the light emitting unit penetrates through the piezoelectric thi...

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PUM

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Abstract

The embodiment of the invention provides a display substrate and a manufacturing method thereof. The display substrate comprises a substrate and a plurality of pixel units disposed on the substrate, wherein the pixel unit includes a light-emitting structure layer and a fingerprint identification structure layer; the light-emitting structure layer includes a light-emitting unit and a light-emittingdriving circuit; the fingerprint identification structure layer comprises a fingerprint identification sensor for forming a fingerprint electrical signal; the fingerprint identification sensor comprises a piezoelectric film layer; the piezoelectric film layer is located between the light-emitting unit and the light-emitting driving circuit and covers the pixel unit; the light-emitting unit is connected to the light-emitting driving circuit through the piezoelectric film layer. The display substrate of the invention covers the entire pixel unit with the piezoelectric film layer, not only realizes an OLED display device having an embedded fingerprint identification function, but also realizes a fingerprint identification function in a display area.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate and a preparation method thereof. Background technique [0002] Organic Light Emitting Diode (OLED) is the development trend of future display products, with a wide viewing angle, fast response, high brightness, high contrast, bright colors, light weight, thin thickness, low power consumption, etc. advantage. Currently, organic light emitting diode display devices have begun to be applied to mobile phone screens. [0003] Ultrasonic fingerprint recognition technology uses the ability of ultrasonic waves to penetrate materials, and produces echoes of different sizes with different materials (that is, when ultrasonic waves reach the surface of different materials, the reflected ultrasonic energy and the distance traveled are different) for fingerprint identification. Yes, compared with capacitive fingerprint recognition devices, ultrasonic fingerprint recogni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L21/77G06K9/00
CPCG06V40/1318H10K59/65H10K59/12H10K59/1201
Inventor 邸云萍
Owner BOE TECH GRP CO LTD
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