PCB quick glue dispensing method

Abstract

The invention discloses a PCB quick glue dispensing method. The PCB quick glue dispensing method comprises the steps that PCBs are conveyed through a second conveyor belt and fed onto a fixed base, and a second cylinder operates to drive a push plate to push the PCBs to slide along the space between two baffles through a telescopic rod; when the PCBs arrive at the position below a first glue dispensing head, the first glue dispensing head conducts glue dispensing on the PCBs; the PCBs continuously slide to the position under a first conveying mechanism, a third cylinder operates to drive a suction cup to descend to suck a chip conveyed through a conveying track, and then the suction cup restores. Through the PCB quick glue dispensing method, glue dispensing is accurate, so that the glue dispensing effect is good in the glue dispensing process; moreover, after glue dispensing, the chip is squeezed through a pressing plate and can be quickly bonded and fixed, the bonding effect is good,time is saved, and using is convenient; meanwhile, the PCB quick glue dispensing method has the advantages that glue dispensing on chips, glue dispensing on chip covers and discharging are integrated;using is more convenient; there is no need to replace equipment at each step of the glue dispensing process, the method is simple, and the investment is little.

Description

technical field [0001] The invention relates to the technical field of glue dispensing, in particular to a method for quickly dispensing glue on a PCB circuit board. Background technique [0002] The PCB board is the provider of the electrical connection of electronic components. The main advantage of using the PCB board is that it greatly improves the automation level and production labor rate. The PCB board needs to go through a series of steps during production and processing, including welding the PCB board. , dispensing, etc., and dispensing requires the use of specific dispensing equipment. [0003] However, the existing PCB board dispensing equipment still has certain defects in use, and the dispensing is not accurate enough, resulting in poor dispensing effect during the dispensing process, and after dispensing, it is usually automatically bonded and fixed, which takes a long time , the bonding effect is poor, and it does not have the function of chip dispensing, ch...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a method for fast glue dispensing of PCB circuit boards, which solves the problem that the dispensing of existing dispensing equipment is not accurate enough, resulting in poor dispensing effect during the dispensing process, and after dispensing, usually It is to make it automatically bonded and fixed, the time is relatively long, and the bonding effect is poor. At the same time, it does not have the function of chip dispensing, chip cover dispensing, and discharge integration, which is more convenient to use. Every step of the dispensing process needs to replace the equipment. More troublesome, large investment and other technical problems

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