The invention belongs to the technical field of electronic components, particularly relates to a glue dispensing and drying device for an electronic component. According to the technical purpose, the glue dispensing and drying device for the electronic component can fully perform glue dispensing for the electronic component, uniform in glue dispensing, and high in drying speed. In order to achieve the technical purposes, the invention provides the glue dispensing and drying device for the electronic component, and the glue dispensing and drying device for the electronic component comprises a base, operating tables, a right side plate, a left side plate, a box body, a containing plate, a first slider and the like; the two operating tables are welded to the middle of the top of the base; the left side plate is welded to the top of the portion, on the left side of the operating tables, of the base; the right side plate is welded to the top of the portion, on the right side of the operating tables, of the base; and the box body is welded between the middle portion of the right side plate and the middle portion of the left side plate. The glue dispensing and drying device for the electronic component performs glue dispensing on the electronic component through a glue pipe, meanwhile, a scraper blade is utilized to make glue scraping of the electronic component uniform, and the electronic component subjected to glue dispensing is fast dried through a heating lamp.