Intelligent automatic glue dispensing device for computer mainboard production

A computer motherboard and automatic glue dispensing technology, applied in the computer field, can solve problems such as running out of glue dispensing head, dripping of glue, uneven pressure of glue dispensing head, etc., and achieve the effect of solving unevenness and accurate dispensing position

Inactive Publication Date: 2020-12-04
魏姗姗
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of making the motherboard, in order to reduce the failure probability of components caused by factors such as cold and heat changes, drops, vibrations, etc. during the use of the product, and prolong the service life of the product, it is usually necessary to use a dispenser to reinforce the surface components. On the main board, during the dispensing process, due to the uneven pressure on the dispensing head, it often leads to unevenness in the dispensing process, and sometimes the dispensing head is used up during the dispensing process. Generally, the colloid is added manually. After one dispensing, the colloid may drip from the inside of the dispensing head again. Therefore, in view of this, the existing structure and defects are studied and improved, and a kind of Intelligent automatic dispensing device for computer motherboard production, in order to achieve more practical value

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent automatic glue dispensing device for computer mainboard production
  • Intelligent automatic glue dispensing device for computer mainboard production
  • Intelligent automatic glue dispensing device for computer mainboard production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing:

[0024] as attached figure 1 to attach Figure 7 Shown:

[0025] The invention provides an intelligent automatic glue dispensing device for computer motherboard production, comprising a glue dispensing seat 1, a protective seat 2 is fixedly connected above the glue dispensing seat 1, and a mounting seat 3 and a protective seat 2 are fixedly connected to the upper surface of the protective seat 2. The inner rotation of the rotating disc 4 is connected with the rotating disc 4, and the inner part of the rotating disc 4 is movably connected with the elastic rod 5, and the inner rotation of the protective seat 2 is connected with the rotating shaft with the same diameter as the rotating disc 4, and the outer surface of the elastic rod 5 is sleeved with an elastic spring. The inside of the rotating disk 4 is provided with a groove equal to the diameter of the elastic rod 5, and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention belongs to the technical field of computers, and particularly relates to an intelligent automatic glue dispensing device for computer mainboard production. A protective seat is fixedly connected to the upper portion of a glue dispensing seat, a mounting seat is fixedly connected to the upper surface of the protective seat, a rotating disc is rotatably connected to the interior of theprotective seat, and an elastic rod is movably connected to the interior of the rotating disc. One end of the elastic rod is fixedly connected with an abutting seat, the upper surface of the glue dispensing seat is slidably connected with an extrusion plate, a pushing rod is slidably connected to the position, located in the glue dispensing seat, of the lower surface of the extrusion plate, and one end of the pushing rod penetrates in an air pressure seat, and a piston column is slidably connected to one end of the pushing rod and located on the inner wall of the air pressure seat. Under thecondition that the pressure intensity is changed, glue in a glue dispensing head cannot drop again, so that the phenomenon that the glue drops again from the glue dispensing head after glue dispensingis finished is avoided, and the normal use of the device is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of computers, and in particular relates to an intelligent automatic dispensing device for computer motherboard production. Background technique [0002] Computer motherboard, also known as motherboard or motherboard, is divided into two types: commercial motherboard and industrial motherboard. It is installed in the case and is one of the most basic and important components of a microcomputer. The motherboard of a computer is important for the performance of a computer. , the impact is very significant, so every step of the motherboard production is very important, the motherboard is generally a rectangular circuit board, the main circuit system that makes up the computer is installed on it, generally there are BIOS chips, I / O control chips, keyboards, etc. and panel control switch interface. [0003] In the process of making the motherboard, in order to reduce the failure probability of components caused b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B05C5/02B05C11/10
CPCB05C5/0208B05C11/1002B05C11/1039
Inventor 魏姗姗
Owner 魏姗姗
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products