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Ceramic substrate manual indentation device and indentation method thereof

A ceramic substrate and indentation technology, which is applied in the field of manual indentation devices for ceramic substrates, can solve the problems of inconvenient access to ceramic substrates, and achieve good indentation effects and convenient access to ceramic substrates

Active Publication Date: 2019-08-16
金洁华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current method is to press a certain depth of indentation on the ceramic substrate. After double-sided indentation, it is easy to separate each unit of the processed LTCC / HTCC. The existing indentation device is inconvenient to take and place the ceramic substrate. , needs to be further optimized

Method used

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  • Ceramic substrate manual indentation device and indentation method thereof
  • Ceramic substrate manual indentation device and indentation method thereof
  • Ceramic substrate manual indentation device and indentation method thereof

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative relationship between the components in a certain posture (as shown in the accompanying drawings). When the positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly. The words "i...

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Abstract

The invention discloses a ceramic substrate manual indentation device and an indentation method thereof. The device comprises a frame, a first support plate, a first rotating shaft, a poking rod, a lower folding plate, an upper folding plate, a guide cylinder, a pressing rod and a second support plate; an indentation cavity is formed in the inner side of the frame for placing ceramic substrates; one end of the first rotating shaft penetrates through the first support plate in a transverse rotating mode; one end of the poking rod is fixedly connected with the first rotating shaft, and the otherend extends to the outer side of the first support plate; the lower section of the lower folding plate tightly sleeves the section, penetrating through the first support plate, of the first rotatingshaft; the inner side of the lower section of the upper folding plate is rotationally connected with the upper section of the lower folding plate through a second rotating shaft, and a shielding plateis fixedly arranged on the inner side wall; the guide cylinder is fixedly arranged on the upper surface of the frame, and a cylinder cavity communicates with the indentation cavity; the lower end ofthe pressing rod movably penetrates through the guide cylinder, and is inserted in the indentation cavity on the inner side of the frame, and an indentation block is fixedly arranged at the bottom; the second support plate is fixed on the side wall of the pressing rod; and the upper section of the upper folding plate is rotationally connected to the inner side of the second support plate through athird rotating shaft.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to a manual indentation device and an indentation method for a ceramic substrate. Background technique [0002] Figure With the advent of the era of integration of various electronic devices, electronic machines have put forward higher requirements for circuit miniaturization, high density, multi-functionality, high reliability, high speed and high power, because co-fired multilayer ceramics The substrate can meet many requirements for the circuit of the electronic machine, so it has been widely used in recent years. Co-fired multi-layer ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic (HTCC) substrates and low-temperature co-fired multi-layer ceramic (LTCC) substrates, which are made of low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. Laser drilling, microporous grouting, precision ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/00B28D7/00
CPCB28D1/00B28D7/00
Inventor 金洁华
Owner 金洁华
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