Ceramic substrate manual indentation device and indentation method thereof

Abstract

The invention discloses a ceramic substrate manual indentation device and an indentation method thereof. The device comprises a frame, a first support plate, a first rotating shaft, a poking rod, a lower folding plate, an upper folding plate, a guide cylinder, a pressing rod and a second support plate; an indentation cavity is formed in the inner side of the frame for placing ceramic substrates; one end of the first rotating shaft penetrates through the first support plate in a transverse rotating mode; one end of the poking rod is fixedly connected with the first rotating shaft, and the otherend extends to the outer side of the first support plate; the lower section of the lower folding plate tightly sleeves the section, penetrating through the first support plate, of the first rotatingshaft; the inner side of the lower section of the upper folding plate is rotationally connected with the upper section of the lower folding plate through a second rotating shaft, and a shielding plateis fixedly arranged on the inner side wall; the guide cylinder is fixedly arranged on the upper surface of the frame, and a cylinder cavity communicates with the indentation cavity; the lower end ofthe pressing rod movably penetrates through the guide cylinder, and is inserted in the indentation cavity on the inner side of the frame, and an indentation block is fixedly arranged at the bottom; the second support plate is fixed on the side wall of the pressing rod; and the upper section of the upper folding plate is rotationally connected to the inner side of the second support plate through athird rotating shaft.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to a manual indentation device and an indentation method for a ceramic substrate. Background technique [0002] Figure With the advent of the era of integration of various electronic devices, electronic machines have put forward higher requirements for circuit miniaturization, high density, multi-functionality, high reliability, high speed and high power, because co-fired multilayer ceramics The substrate can meet many requirements for the circuit of the electronic machine, so it has been widely used in recent years. Co-fired multi-layer ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic (HTCC) substrates and low-temperature co-fired multi-layer ceramic (LTCC) substrates, which are made of low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. Laser drilling, microporous grouting, precision ...

AI Technical Summary

Problems solved by technology

[0003] The current method is to press a certain depth of indentation on the ceramic substrate. After double-sided indentation, it is easy to separate each unit of the processed LTCC / HTCC. The existing indentation device is inconvenient to take and place the ceramic substrate. , needs to be further optimized

Images