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A kind of led module sealing process

A technology of LED modules and processes, applied in lighting and heating equipment, components of lighting devices, light sources, etc., can solve the problems of cumbersome installation steps and complex sealing structure.

Active Publication Date: 2021-05-11
HANGZHOU HPWINNER OPTO CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The sealing structure of the light source part of the existing integrated street lamp is usually sealed by the method of "solid sealing ring + liquid sealing ring + pressure frame + screw", but this sealing method needs to use two types of sealing rings, and the sealing structure is complicated , and also need to use a pressure frame and a large number of screws, the installation steps are relatively cumbersome, so it is necessary to provide a module sealing process with simple steps and high sealing performance

Method used

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  • A kind of led module sealing process
  • A kind of led module sealing process
  • A kind of led module sealing process

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Embodiment

[0057] A kind of LED module sealing process, see Figure 1-Figure 2 , including the following steps:

[0058] (1) Forming the lamp housing, the lamp housing 1 is integrally formed with a screw column 1-1, the first glue groove 1-2; forming a lens 2, and the lens 2 is integrally formed with a through hole 2-1, a second Glue groove 2-2; Assemble the LED lamp bead 5-2, the wire 9 and the PCB board 5-1 with the round hole 5-1-1 to form the light source assembly 5; it should be understood that the screw column should be provided with a screw The hole is used to cooperate with the screw, and the screw hole can be punched on the screw column by machining;

[0059] (2) Apply a ring of sealant 4 evenly on the first glue groove 1-2 on the lamp housing 1 obtained in step (1); Apply a ring of sealant 4 evenly on the glue tank 2-2;

[0060] (3) Install the light source assembly 5 in step (1) on the lamp housing 1 processed in step (2), at this time, the circular hole 5-1-1 of the PCB bo...

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Abstract

The invention discloses a LED module sealing process, which includes (1) forming a lamp housing and a lens, assembling LED lamp beads, wires and a PCB board to form a light source assembly; (2) applying sealant on the first glue groove; Dot sealant on the glue tank; (3) Install the light source assembly in step (1) on the lamp housing treated in step (2); (4) Buckle the lens treated in step (2) to the treated lens in step (3) On the lamp housing, press the lens and the lamp housing so that the sealants of the first glue groove and the second glue groove are closely bonded; (5) screw the screw into the through hole and the screw column of step (4), Thereby fixing the lens and the lamp housing; (6) dispensing glue on the head of the screw assembled in step (5) to perform waterproof sealing; (7) standing the module and curing the sealant. The present invention realizes the sealing of the joint between the lamp housing and the lens through the bonding of the sealant in the glue tank, and realizes further sealing of the screw joint by dispensing glue on the head of the screw; the sealing process is simple, and the sealing between the lens and the lamp housing is Good performance.

Description

technical field [0001] The invention belongs to the technical field of sealing LED light-emitting devices, and in particular relates to an LED module sealing process and an LED lighting device. Background technique [0002] LED is more and more widely used due to its characteristics of energy saving and environmental protection, long service life, short start-up time, good safety and stability, and more and more LED lighting devices appear on the market at present. [0003] The sealing structure of the light source part of the existing integrated street lamp is mostly sealed by the method of "solid sealing ring + liquid sealing ring + pressure frame + screw", but this sealing method needs to use two types of sealing rings, and the sealing structure is complicated , and also need to use a pressure frame and a large number of screws, the installation steps are relatively cumbersome, so it is necessary to provide a module sealing process with simple steps and high sealing perfo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V31/04F21V17/12F21Y115/10
CPCF21V17/12F21V31/04F21Y2115/10
Inventor 陈凯黄建明
Owner HANGZHOU HPWINNER OPTO CORP
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