Wafer-level packaging light-emitting device with electrode identification and manufacturing method thereof

Abstract

The invention provides a chip-scale package light-emitting device and a manufacturing method thereof. The light-emitting device comprises an LED chip and a package structure. The LED chip comprises anupper surface, a lower surface, a first vertical surface, a second vertical surface and a pair of electrode groups, a first horizontal direction and a second horizontal direction which are verticallystaggered are defined on the upper surface, the first vertical surface and the second vertical surface are separated in the first horizontal direction, and the pair of electrode groups is set on thelower surface. A package structure covers the upper surface of the LED chip, the first vertical surface and the second vertical surface and includes a first side and a second side separated in the first horizontal direction. A first area is defined between the first side surface and the first vertical surface, and a second area is defined between the second side surface and the second vertical surface. Therefore, the electrode orientation of the LED chip can be identified by identifying the sizes of the first and second areas.

Description

technical field [0001] The present invention relates to a light-emitting device and its manufacturing method, in particular to a chip-level packaging light-emitting device with electrode identification and its manufacturing method. Background technique [0002] LED (Light Emitting Diode) chips are commonly used to provide light sources for illumination, display or indication, and LED chips are usually disposed in a packaging structure (which may contain fluorescent materials) to become a light emitting device. [0003] With the development of LED technology, chip-scale package (CSP) light-emitting devices have been paid more and more attention in recent years due to their obvious advantages. Compared with traditional bracket-type LEDs and ceramic substrate-type LEDs, CSP light-emitting devices have the following advantages: (1) No gold wires and additional brackets or submounts such as ceramic substrates are required, so material costs can be significantly saved; ( 2) Becau...

AI Technical Summary

Problems solved by technology

However, the size of the fluorescent layer itself is very small, and it is difficult to form smaller grooves or through grooves on it. Reasons such as: need to use better precision tools to make the groove or through groove have extremely small size

It is more difficult to add other materials in the groove or through groove, for example: due to the extremely small size of the groove or through groove, it is difficult for the uncured material to flow into the groove or through groove, causing the material to not fill Grooves or through grooves, or cause material to lie outside of grooves or through grooves

[0006] Therefore, in addition to increasing the manufacturing process of CSP light-emitting devices by adopting this method, the yield rate of "formation of grooves or through grooves" and "addition of other materials" should not meet expectations, which may eventually lead to the production of CSP light-emitting devices. The rate and yield rate have dropped significantly

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