3c Manufacturing method of curved shell for electronic device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 何英信
- Publication Date
- 2021-09-10
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Abstract
Description
Technical field
[0001] The present invention has a housing for a method of manufacturing the surface 3C of the electronic device, especially one having a curved surface, the curved arc portion of the manufacturing method of the housing, the interior of the main housing pattern allows an accurate alignment, and are pressed in the liquid bonding the flat state, without generating wrinkles curved arc portion phenomenon invention for its application. Background technique
[0002] With the progress of modern society and the development of science and technology, people have become increasingly demanding consumer electronics products (such as slim and light volume, diverse functions, textured appearance, etc.). Therefore, the current consumer electronics products to thin and light design concept based. On the current common market of high-end electronic products, its shell material is typically a metal or carbon fiber composite material based. Two materials are lightweight and has high...