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Heat transfer device

A technology of heat conduction layer and thermal conductivity, which is applied in indirect heat exchangers, heat exchange equipment, lighting and heating equipment, etc., can solve the problems of setting costs, poor heat conduction effect, inconvenient high-density mounting, etc., and achieves convenience The effect of using

Inactive Publication Date: 2019-08-23
JOINSET
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, when the shape of the heat pipe is curved or the like is complicated and the length is long, it is necessary to prepare the shape of the double-sided adhesive tape accordingly. It is difficult to prepare and install the tank in a matching way
[0009] Also, in order to fix the heat pipe, an additional double-sided adhesive tape is required, so it has the disadvantage of being inconvenient for high-density mounting and requiring additional setup costs
[0010] Moreover, since the heat pipe is made of metal, it cannot elastically thermally contact the heat source or the metal shell for cooling, so that it cannot conduct heat quickly and reliably.
[0011] Therefore, it is usually necessary to additionally interpose thermally conductive components such as thermal pads (Thermal Pad), thermal grease (Thermal Grease) or heat dissipation space fillers (Thermal Gap Filler) between the heat pipe and the heat source, or between the cooling shell. Shortcomings
[0012] In particular, in the case where a heat pipe made of metal is combined and in contact with a plurality of metal fins for cooling, there is a disadvantage that the heat conduction effect is not good due to direct contact between metal and metal

Method used

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Embodiment Construction

[0036] It should be noted that the technical terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. In addition, if the technical terms used in the present invention are not specifically defined as other meanings in the present invention, they should be interpreted as meanings that are generally understood by those with basic knowledge in the technical field to which the present invention belongs, and should not be interpreted as excessively covered meaning or over-reduced meaning. Furthermore, when technical terms used in the present invention are fallacious technical terms that cannot accurately express the idea of ​​the present invention, they should be replaced with technical terms that can be correctly understood by those skilled in the art. And, general terms used in the present invention should be interpreted as meanings defined in dictionaries, or should be interpreted according to the co...

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Abstract

A heat transfer device configured to be independently fixed and densely mounted is disclosed. The heat transfer device includes: a main body formed of a metallic material and forming a tube sealed tomaintain a vacuum therein; and a thermally conductive layer having elasticity and flexibility and adhered around the main body.

Description

technical field [0001] The invention relates to a heat conduction device, in particular to a heat conduction device that can be independently fixed and can be easily mounted with high density. Background technique [0002] Recently, the amount of heat generated by the high integration and performance of heat-generating electronic components or modules is increasing. In addition, as product miniaturization progresses, heat generation density increases, and heat dissipation methods are becoming more important. [0003] This situation is more obvious in mobile terminals such as smart phones or tablet computers, and the generated heat needs to be cooled directly or transferred to other places for cooling. [0004] As the heat transfer device, a heat transfer plate or a graphite plate with good thermal conductivity in the horizontal direction can be used, but if the heat transfer is not sufficient, a heat transfer pipe, a heat sink or a soaking plate (hereinafter referred to as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20436F28D15/0275F28F2235/00H01L21/4878H01L23/427C09D133/00C09D183/00C09J11/04C09J133/00C09J183/00C09D7/61F28D15/0233F28D15/0241
Inventor 金善基
Owner JOINSET